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參數(shù)資料
| 型號： | 74HCT14D-T |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大小： | 78K |
| 代理商： | 74HCT14D-T |
2002 May 15
13
Philips Semiconductors
Product specification
Bus buffer/line driver; 3-state
74HC1G126; 74HCT1G126
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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| 74HCT14DTR2G | 功能描述:變換器 HEX SCHMITT TRIGGER INVERTER RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| 74HCT14E | 制造商:Semiconductors 功能描述: |
| 74HCT14N | 制造商:NXP Semiconductors 功能描述:HCT Inverter Schmitt Trigger 制造商:NXP Semiconductors 功能描述:HCT Inverter Schmitt Trigger Bulk 制造商:NXP Semiconductors 功能描述:IC 74HCT CMOS 74HCT14 DIP14 5V 制造商:NXP Semiconductors 功能描述:IC, 74HCT CMOS, 74HCT14, DIP14, 5V 制造商:NXP 功能描述:Schmitt Trigger DIP-14 Inverter 制造商:NXP Semiconductors 功能描述:IC, INVERTER, SCHMITT TRIGGER, DIP-14; Logic Type:Inverter Schmitt Trigger; Output Current:4mA; No. of Inputs:1; Supply Voltage Min:4.5V; Supply Voltage Max:5.5V; Logic Case Style:DIP; No. of Pins:14; Operating Temperature Min:-40C ;RoHS Compliant: Yes 制造商:NXP Semiconductors 功能描述:Hex invertor,74HCT14N DIP14 4.5-5.5V 制造商:NXP Semiconductors 功能描述:Inverter Schmitt Trigger 6-Element CMOS 14-Pin PDIP Bulk |
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| 74HCT14N,652 | 功能描述:變換器 HEX INV SCHMT-TRIG RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
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