參數(shù)資料
型號(hào): 74HC4040DB,118
廠商: NXP Semiconductors
文件頁數(shù): 14/20頁
文件大?。?/td> 0K
描述: IC 12STAGE BINARY RIPPLE 16SSOP
產(chǎn)品培訓(xùn)模塊: Logic Packages
標(biāo)準(zhǔn)包裝: 2,000
系列: 74HC
邏輯類型: 二進(jìn)制計(jì)數(shù)器
方向:
元件數(shù): 1
每個(gè)元件的位元數(shù): 12
復(fù)位: 異步
計(jì)數(shù)速率: 98MHz
觸發(fā)器類型: 負(fù)邊沿
電源電壓: 2 V ~ 6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 帶卷 (TR)
其它名稱: 74HC4040DB-T
74HC4040DB-T-ND
935174930118
74HC_HCT4040
All information provided in this document is subject to legal disclaimers.
NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 4 — 20 March 2014
3 of 20
NXP Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
6.
Pinning information
6.1 Pinning
Fig 4.
Logic diagram
001aad588
CP
MR
FF
1
Q
T
RD
Q0
Q
FF
2
Q
T
RD
Q1
Q
FF
7
Q
T
RD
Q6
Q
FF
8
Q
T
RD
Q7
Q
FF
9
Q
T
RD
Q8
Q
FF
10
Q
T
RD
Q9
Q
FF
11
Q
T
RD
Q10
Q
FF
12
Q
T
RD
Q11
Q
FF
3
Q
T
RD
Q2
Q
FF
4
Q
T
RD
Q3
Q
FF
5
Q
T
RD
Q4
Q
FF
6
Q
T
RD
Q5
Q
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5.
Pin configuration DIP16, SO16, SSOP16 and
TSSOP16
Fig 6.
Pin configuration DHVQFN16
4040
Q11
VCC
Q5
Q10
Q4
Q9
Q6
Q7
Q3
Q8
Q2
MR
Q1
CP
GND
Q0
001aad583
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
001aad584
4040
Q1
CP
Q2
MR
Q3
Q8
Q6
Q7
Q4
Q9
Q5
Q10
GND
Q0
Q11
V
CC
Transparent top view
7
10
6
11
5
12
4
13
3
14
2
15
8
9
1
16
terminal 1
index area
GND(1)
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