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參數(shù)資料
| 型號(hào)： | 74HC2G08 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Dual 2-input AND gate |
| 中文描述： | 雙2輸入與門 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 83K |
| 代理商： | 74HC2G08 |
2003 May 14
14
Philips Semiconductors
Product specification
Dual 2-input NOR gate
74HC2G02; 74HCT2G02
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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| 74HC2G126 | Dual buffer/line driver; 3-state |
| 74HC2G32 | Dual 2-input OR gate |
| 74HC2G14 | Inverting Schmitt-triggers |
| 74HC2G00 | Dual 2-input NAND gate |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74HC2G08DC | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual 2-input AND gate |
| 74HC2G08DC,125 | 功能描述:邏輯門 DUAL TWO-INPUT AND RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時(shí)間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74HC2G08DC-G | 功能描述:邏輯門 DUAL TWO-INPUT AND GATE RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時(shí)間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74HC2G08DC-Q100H | 制造商:NXP Semiconductors 功能描述:74HC2G08DC-Q100/VSSOP8/REELR// 制造商:NXP Semiconductors 功能描述:74HC2G08DC-Q100/VSSOP8/REELR// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC GATE AND DUAL 2-INPUT 8VSSOP |
| 74HC2G08DP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual 2-input AND gate |
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