- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄360459 > 74HC1G32 (NXP Semiconductors N.V.) 2-input OR gate(2輸入或門(mén)) PDF資料下載
參數(shù)資料
| 型號(hào)： | 74HC1G32 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 2-input OR gate(2輸入或門(mén)) |
| 中文描述： | 2輸入或門(mén)（2輸入或門(mén)） |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大小： | 602K |
| 代理商： | 74HC1G32 |
1997 Dec 16
10
Philips Semiconductors
Product specification
2-input OR gate
74HC1G32
74HCT1G32
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45
°
C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within 6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10seconds at up to 300
°
C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320
°
C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 74HCT1G32 | 2-input OR gate(2輸入或門(mén)) |
| 74HC1G86 | 2-input EXCLUSIVE-OR gate(2輸入異或門(mén)) |
| 74HCT1G86 | 2-input EXCLUSIVE-OR gate(2輸入異或門(mén)) |
| 74HC240 | Octal buffer/line driver; 3-state; inverting |
| 74HCT240 | Octal buffer/line driver; 3-state; inverting |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74HC1G32GV | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2-input OR gate |
| 74HC1G32GV,125 | 功能描述:邏輯門(mén) SINGLE 2-INPUT OR GATE RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時(shí)間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| 74HC1G32GV125 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| 74HC1G32GV-Q100H | 制造商:NXP Semiconductors 功能描述:74HC1G32GV-Q100/SO5/REELR// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC GATE OR 2-INPUT 5TSOP |
| 74HC1G32GW | 制造商:NXP Semiconductors 功能描述:IC 74HC SINGLE GATE SMD 74HC1G32 制造商:NXP Semiconductors 功能描述:IC, 74HC SINGLE GATE, SMD, 74HC1G32 制造商:NXP Semiconductors 功能描述:IC, 74HC SINGLE GATE, SMD, 74HC1G32; Logic Type:OR; Output Current:2.6mA; No. of Inputs:2; Supply Voltage Min:2V; Supply Voltage Max:6V; Logic Case Style:SOT-353; No. of Pins:5; Operating Temperature Min:-40C; Operating Temperature ;RoHS Compliant: Yes |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。