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Philips Semiconductors
Product specification
74F244/74F244B
Octal buffers (3-State)
1994 Dec 5
5
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
LIMITS
TYP
2
UNIT
CONDITIONS
1
MIN
MAX
V
CC
= MIN,
I
OH
= -3mA
±
10%V
CC
2.5
V
V
OH
High-level output voltage
V
IL
= MAX,
±
5%V
CC
2.7
3.4
V
V
IH
= MIN
I
OH
= -15mA
±
10%V
CC
2.0
V
±
5%V
CC
2.0
V
V
OL
Low-level output voltage
V
CC
= MIN,
V
IL
= MAX,
V
IH
= MIN,
V
CC
= MIN, I
I
= I
IK
V
CC
= MAX, V
I
= 7.0V
V
CC
= MAX, V
I
= 2.7V
I
OL
= MAX
±
10%V
CC
0.55
V
±
5%V
CC
0.42
0.55
V
V
IK
I
I
I
IH
Input clamp voltage
-0.73
-1.2
V
μ
A
μ
A
Input current at maximum input voltage
100
High-level input current
20
74F244 OEa, OEb
-1.0
mA
I
IL
Low-level input current
74F244 Ian, Ibn
V
CC
= MAX, V
I
= 0.5V
-1.6
mA
74F244B all inputs
-40
μ
A
I
OZH
Off-state output current,
high-level voltage applied
V
CC
= MAX, V
O
= 2.7V
50
μ
A
I
OZL
Off-state output current,
low-level voltage applied
V
CC
= MAX, V
O
= 0.5V
-50
μ
A
I
OS
Short-circuit output current
3
V
CC
= MAX
-100
-225
mA
I
CCH
I
CCL
I
CCZ
I
CCH
I
CCL
I
CCZ
40
60
mA
74F244
V
CC
= MAX
60
90
mA
I
CC
Supply current (total)
60
90
mA
20
30
mA
74F244B
V
CC
= MAX
50
70
mA
29
40
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25
°
C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.