參數(shù)資料
型號(hào): 73S8024RN-20IMR/F
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, QCC20
封裝: 4 X 4 MM, 0.850 MM HEIGHT, LEAD FREE, QFN-20
文件頁(yè)數(shù): 20/27頁(yè)
文件大?。?/td> 319K
代理商: 73S8024RN-20IMR/F
DS_8024RN_020
73S8024RN Data Sheet
Rev. 1.9
27
Revision History
Revision
Date
Description
1.1
5/18/2004
First publication.
1.2
11/5/2004
1.3
4/27/2005
Added 20QFN package option and ordering information. Updated 32 QFN
ordering information.
1.4
7/15/2005
1.5
8/23/2005
1.6
12/5/2007
Removes leaded package options, replaces 32QFN punched with SAWN
mechanical dimensions, update 28SO package dimensions.
1.7
1/17/2008
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
1.8
1/19/2009
In Figure 1, modified the device block diagram to make pin 2 a no connect.
Also, changed the pin description.
In Figure 9, changed the mechanical drawing for the 20QFN package.
Added the NDS logo to page 1 and assigned document number.
Added the Related Documentation and the Contact Information sections.
1.9
5/27/2010
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
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All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
73S8024RN-32IM/F 功能描述:IC SMART CARD INTERFACE 32-QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN(6x6) 包裝:* 其它名稱:Q6396337A
73S8024RN-32IMR/F 功能描述:IC SMART CARD INTERFACE 32-QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN(6x6) 包裝:* 其它名稱:Q6396337A
73S8024RN-DB 功能描述:界面開發(fā)工具 73S8024RN Demo Brd RoHS:否 制造商:Bourns 產(chǎn)品:Evaluation Boards 類型:RS-485 工具用于評(píng)估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V
73S8024RN-IL 制造商:TERIDIAN 功能描述: 制造商:TDK 功能描述:SPECIALTY ANALOG CIRCUIT, 28 Pin Plastic SMT
73S8024RN-IL/F 功能描述:輸入/輸出控制器接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray