參數(shù)資料
型號(hào): 73S8010R-IL/F
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PDSO28
封裝: LEAD FREE, SOP-28
文件頁(yè)數(shù): 5/25頁(yè)
文件大小: 336K
代理商: 73S8010R-IL/F
DS_8010R_022
73S8010R Data Sheet
Rev. 1.6
13
3
Applications Information
This section provides general usage information for the design and implementation of the 73S8010R.
3.1
Example 73S8010R Schematics
Figure 4 shows a typical application schematic for the implementation of the 73S8010R. Note that minor changes may occur to the reference
material from time to time and the reader is encouraged to contact Teridian for the latest information
SO28
See NOTE 4
VDD
Y1
CRYSTAL
C2
22pF
C1
ISO7816=1uF, EMV=3.3uF
SDA_to/from_uC
SAD1
CLK track should be routed
far from RST, I/O, C4 and
C8.
NOTES:
1) VDD = 2.7V to 5.5V DC.
2) VPC = 4.75V(EMV, ISO) to 5.5V DC
3) Required if external clock from uP is used.
4) Required if crystal is used.
Y1, C2 and C3 must be removed if external clock is used.
5) Optional. Can be left open.
6) R1 and R3 are external resistors that adjust the VDD
fault voltage. Can be left open.
I/OUC_to/from_uC
R1
Rext1
See NOTE 1
Card detection
switch is
normally closed
VPC
C6
100nF
VDD
External_clock_from uC
C4
100nF
C3
22pF
AUX1UC_to.from_uC
See NOTE 5
C5
10uF
AUX2UC_to/from_uC
See NOTE 3
See note 2
VDD
Low ESR (<100mohms) C1
should be placed near the SC
connecter contact
SAD0
SCK_from_uC
73S8010R
1
2
3
4
5
6
7
12
8
9
10
11
13
14
15
16
17
18
19
20
21
22
23
28
27
25
24
26
SAD0
SAD1
SAD2
GND
VPC
NC
AUX2
NC
PRES
I/O
AUX1
GND
CLK
RST
VCC
VDDF_ADJ
SCL
SDA
VDD
GND
INT
AUX2UC
AUX1UC
XTALOUT
XTALIN
I/OUC
SAD2
INT_interrupt_to_uC
R3
Rext2
- OR -
R2
20K
See note 6
Smart Card Connector
1
2
3
4
5
6
7
8
9
10
V
CC
RS
T
CLK
C4
G
ND
VPP
I/O
C8
SW
-1
SW
-2
R4
R5
2K
7) Hardware to define address of device
See note 7
Figure 4: Typical 73S8010R Application Schematic
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73S8010R-ILR/F 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
73S8010R-IM/F 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
73S8010R-IM/F1 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
73S8010R-IM/F2 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
73S8010R-IMR/F 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16