型號: | 70T633S10BCI8 |
元件分類: | 開關(guān) |
英文描述: | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
文件頁數(shù): | 7/7頁 |
文件大?。?/td> | 525K |
代理商: | 70T633S10BCI8 |
相關(guān)PDF資料 |
PDF描述 |
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70T633S8BF8 | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
7134LA45JGB | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
71T75802S150PFG8 | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
71T75802S200PFI8 | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
7P002FVA0201C15 | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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70T633S10BF | 功能描述:靜態(tài)隨機(jī)存取存儲器 512K X 18 STD-PWR, 2.5V DUAL PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
70T633S10BF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 208-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 2.5V 9MBIT 512KX18 10NS 208FPBGA - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:512K X 18 STD-PWR, 2.5V DUAL PORT RAM |
70T633S10BFG | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 208-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:208 FPBGA - Bulk 制造商:Integrated Device Technology Inc 功能描述:512K X 18 STD-PWR, 2.5V DUAL PORT RAM |
70T633S10BFG8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 208-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:208 FPBGA - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:512K X 18 STD-PWR, 2.5V DUAL PORT RAM |
70T633S10BFI | 功能描述:靜態(tài)隨機(jī)存取存儲器 512K X 18 STD-PWR, 2.5V DUAL PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |