參數(shù)資料
型號: 6N140A/L2
廠商: ISOCOM LTD
元件分類: 光電耦合器
英文描述: 4 CHANNEL LOGIC OUTPUT OPTOCOUPLER
封裝: ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, DIP-16
文件頁數(shù): 6/12頁
文件大小: 443K
代理商: 6N140A/L2
ISOCOMLTD
For sales enquiries, or further information, please contact our sales office at:
Isocom Ltd, Hutton Close, Crowther Industrial Estate, District 3, Washington, NE38 0AH
Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
2007 Copyright reserved to Isocom Limited
Page 3 of 12
QC 88000-C001: 2007
Ceramic Hermetically Sealed High Gain Optocouplers
■ 6N140A
■ CS5700
■ CD750
■ CSM141/A
■ CD5731
■ CSM160/161/162-2
■ CH370
■ CSM160/161/162-4
■ CS700
■ CSM1700
Features
Applications
Release to IECQ-CECC
Military, high reliability system
Hermetically Sealed
Medical instruments
High Density Packaging
Mos, Cmos Applications
1500V DC withstand Test Voltage
Logic Interfacing
Low Input Requirements: 0.5mA
Data Transmission
High Current Transfer Ratio: 1000% Typical
Transportation
RoHS Compliant
Description
Each channel contains a light emitting diode which is optically coupled to an integrated high gain
photon detector. The high gain output stage features an open collector output providing both lower
saturation voltage and higher signalling speed than a conventional Photo-Darlington optocoupler.
The supply voltage can be operated as low as 2.0V without adversely affecting the parametric
performance. The High Current Transfer Ratio of the optocouplers makes them ideal for low input
current, min 0.5mA, applications.
The radiation immunity of the optocouplers compared to conventional photo transistor optocouplers
is due to the shallow depth and small junctions offered by the IC process.
The optocoupler family is also available in various package styles including 6, 8 and 16 pin DIP
through hole, 16 pin surface mount DIP flat pack and a 6 Pin leadless ceramic chip carrier. The
devices can be purchased with lead bend and plating options.
ISOCOM optocouplers are offered on the basis of similarity of emitter and detector therefore the
performance characterization is identical, subject to the limitations of the packages. The wafer die
similarities apply to the optocouplers for high reliability screening and radiation testing.
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