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參數(shù)資料
| 型號(hào)： | 6MBI300U4-120 |
| 廠商： | FUJI ELECTRIC CO LTD |
| 元件分類： | IGBT 晶體管 |
| 英文描述： | IGBT MODULE |
| 中文描述： | 450 A, 1200 V, N-CHANNEL IGBT |
| 封裝： | MODULE-29 |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 536K |
| 代理商： | 6MBI300U4-120 |
H04-004-03a
MS5F6022
14
a
5
6.Recommend way of module mounting to Heat sink Clamping
(1) Initial : 1/3 specified torque, sequence (1)
→
(2)
→
(3)
→
(4)
→
(5)
→
(6)
→
(7)
→
(8)
(2) Final
：
Full specified torque (3.5 Nm),sequence(4)
→
(3)
→
(2)
→
(1)
→
(8)
→
(7)
→
(6)
→
(5)
Logo of production
Lot.No.
Place of manufacturing (code)
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
module surface.
9. Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35
o
C and humidity of 45 to 75% .
Store modules in a place with few temperature changes in order to avoid condensation on the
8. Applicable category
This specification is applied to IGBT-Module named 6MBI300U4-120.
-
-
6MBI300U4-120
300A 1200V
Contact Thermal resistance
(1 device) (*6)
(*6) This is the value which is defined mounting on the additional cooling fin with thermal compound.
Rth(c-f)
with Thermal Compound
Avoid exposure to corrosive gases and dust.
Avoid excessive external force on the module.
Rth(j-c)
0.0167
Thermal resistance(1device)
IGBT
FWD
-
-
-
0.09
0.15
5. Thermal resistance characteristics
Items
Symbols
Conditions
Units
min.
typ.
max.
Characteristics
7. Indication on module
-
o
C/W
(7)
(3)
(1)
(5)
(8)
(4)
(2)
(6)
Mounting holes
Heat sink
Module
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