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參數(shù)資料
| 型號(hào)： | 6364/BADA-AHKA/P/MS |
| 廠商： | EVERLIGHT ELECTRONICS CO LTD |
| 元件分類(lèi)： | LED |
| 英文描述： | SINGLE COLOR LED, BLUE, 5.2 mm |
| 封裝： | ROHS COMPLIANT, PLASTIC PACKAGE-2 |
| 文件頁(yè)數(shù)： | 6/9頁(yè) |
| 文件大小： | 103K |
| 代理商： | 6364/BADA-AHKA/P/MS |
Technical Data Sheet
6364/BADA-AHKA/X/MS
Everlight Electronics Co., Ltd.
http\\:www.everlight.com
Rev 1
Page: 6 of 9
Device Number : DLE-0000064
Prepared date:06-18-2009
Prepared by: Flourix Chen
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more,
they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture
absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
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