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參數(shù)資料
| 型號： | 5962R9653401QXX |
| 元件分類： | 鎖存器 |
| 英文描述： | AC SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14 |
| 封裝： | BOTTOM BRAZED, CERAMIC, DFP-14 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 233K |
| 代理商： | 5962R9653401QXX |
9
UT54ACS74/UT54ACTS74: SMD
5962
*****
**
*
Lead Finish: (Notes 1 & 2)
A = Solder
C = Gold
X = Optional
Package Type:
X = 14-lead ceramic bottom-brazed dual-in-line Flatpack
C = 14-lead ceramic side-brazed dip
Class Designator:
Q = QML Class Q
V = QML Class V
Device Type:
01
Drawing Number:
96534 = UT54ACS74
96535 = UT54ACTS74
Total Dose: (Notes 3 & 4)
R = 1E5 rads(Si)
F = 3E5 rads(Si)
G = 5E5 rads(Si)
H = 1E6 rads(Si)
Notes:
1. Lead finish (A,C, or X) must be specified.
2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening. For prototype inquiries, contact factory.
4. Device type 02 is only offered with a TID tolerance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test Method 1019
Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E5 rads(Si), 3E5 rads(Si), and 5E5 rads(Si), and is tested in
accordance with MIL-STD-883 Test Method 1019 Condition A.
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