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參數(shù)資料
| 型號： | 5962F9764101VXC |
| 廠商： | INTERSIL CORP |
| 元件分類： | 小信號晶體管 |
| 英文描述： | Radiation Hardened Ultra High Frequency NPN Transistor Array |
| 中文描述： | 5 CHANNEL, UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR |
| 封裝： | HERMETIC SEALED, CERAMIC, DFP-16 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 33K |
| 代理商： | 5962F9764101VXC |
3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certication.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
52 mils x 52.8 mils x 15 mils
±1 mil
1320
m x 1340m x 381m ±25.4m
INTERFACE MATERIALS:
Glassivation:
Type: Nitride
Thickness: 4k
±0.5k
Top Metallization:
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
±0.5k
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16k
±0.8k
Substrate:
UHF-1X Bonded Wafer, DI
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Floating
ADDITIONAL INFORMATION:
Worst Case Current Density:
3.04 x 105A/cm2
Transistor Count:
5
Metallization Mask Layout
HS-6254RH
NOTE: Pad numbers correspond to the 16 lead pinout.
1
2
3
4
5
6
78
9
10
11
12
13
14
15
16
HS-6254RH
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