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  • 參數(shù)資料
    型號(hào): 5962F9584506VYC
    英文描述: x8 SRAM
    中文描述: x8的SRAM
    文件頁數(shù): 34/41頁
    文件大?。?/td> 290K
    代理商: 5962F9584506VYC
    SIZE
    A
    5962-94663
    STANDARD
    MICROCIRCUIT DRAWING
    DEFENSE SUPPLY CENTER COLUMBUS
    COLUMBUS, OHIO 43216-5000
    REVISION LEVEL
    B
    SHEET
    34
    DSCC FORM 2234
    APR 97
    g.
    Test four devices with zero failures.
    h.
    For SEP test limits, see table IB herein.
    5. PACKAGING
    5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
    classes Q and V or MIL-PRF-38535, appendix A for device class M.
    6. NOTES
    6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
    (original equipment), design applications, and logistics purposes.
    6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
    contractor-prepared specification or drawing.
    6.1.2 Substitutability. Device class Q devices will replace device class M devices.
    6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
    the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
    6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
    application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of
    users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
    microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
    6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
    (614) 692-0547.
    6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
    MIL-PRF-38535, MIL-HDBK-1331, and table III herein.
    6.6 Sources of supply.
    6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
    QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and
    have agreed to this drawing.
    6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
    The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
    submitted to and accepted by DSCC-VA.
    6.7 Additional information. A copy of the following additional data shall be maintained and available from the device
    manufacturer:
    a.
    RHA upset levels.
    b.
    Test conditions (SEP).
    c.
    Number of upsets (SEP).
    d.
    Number of transients (SEP).
    e.
    Occurrence of latchup (SEP).
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