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參數(shù)資料
| 型號(hào)： | 5962-9463201MPX |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHED CAPACITOR CONVERTER, CDIP8 |
| 封裝： | CERAMIC, DIP-8 |
| 文件頁(yè)數(shù)： | 8/15頁(yè) |
| 文件大?。?/td> | 1397K |
| 代理商： | 5962-9463201MPX |
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MAX44251/MAX44252
20V、超高精度、低噪聲運(yùn)算放大器
Supply Voltage (VDD to VSS).................................-0.3V to +22V
All Other Pins..................................(VSS - 0.3V) to (VDD + 0.3V)
Short-Circuit Duration to Either Supply Rail ............................ 1s
Continuous Input Current (any pin)................................. ±20mA
Differential Input Voltage...................................................... ±6V
Maximum Power Dissipation (TA = +70°C)
SOT23 (derate 9.1 mW/°C above +70°C)...................727mW
MAX (derate 4.5 mW/°C above +70°C) ....................362mW
SOIC (derate 8.3 mW/°C above +70°C) ..................666.7mW
Operating Temperature Range........................ -40°C to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65°C to +150NC
Lead Temperature (soldering, 10s) .............................. +300NC
Soldering Temperature (reflow) .................................... +260NC
SOT23
Junction-to-Ambient Thermal Resistance (ΘJA) ....... 196°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............70°C/W
MAX
Junction-to-Ambient Thermal Resistance (ΘJA) ........221°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............42°C/W
SOIC
Junction-to-Ambient Thermal Resistance (ΘJA) ........120°C/W
Junction-to-Case Thermal Resistance (ΘJC) ...............37°C/W
Absolute MAxiMuM RAtings
note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to china.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PAckAge theRMAl chARActeRistics (note 1)
electRicAl chARActeRistics
(VDD = 10V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, TA = -40°C to +125°C, unless otherwise noted. Typical values are
at TA = +25°C.) (Note 2)
PARAMeteR
sYMbol
conDitions
Min
tYP
MAx
units
PoWeR suPPlY
Supply Voltage Range
VDD
Guaranteed by PSRR
2.7
20
V
Power-Supply Rejection Ratio
(Note 3)
PSRR
VDD = 2.7V to 20V, VCM = 0V
140
145
dB
Quiescent Current per Amplifier
IDD
RL = J
TA = +25NC
1.15
1.55
mA
-40NC < TA < +125NC
1.75
Power-Up Time
tON
25
F
s
Dc sPeciFicAtions
Input Common-Mode Range
VCM
Guaranteed by CMRR test
VSS -
0.05
VDD -
1.5
V
Common-Mode Rejection Ratio
(Note 3)
CMRR
TA = +25NC, VCM = -0.05V to (VDD -
1.5V)
133
140
dB
-40NC < TA < +125NC
130
Maxim Integrated
2
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