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參數(shù)資料
| 型號(hào)： | 5962-9166501HXX |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 運(yùn)算放大器 |
| 英文描述： | OP-AMP, 2000 uV OFFSET-MAX, MBCY12 |
| 封裝： | METAL CAN, TO-8, 12 PIN |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 132K |
| 代理商： | 5962-9166501HXX |
DATA SHEET
KH232
4
REV. 1A February 2001
Operation
The KH232 is based on the current feedback op amp
topology, a design that uses current feedback instead of
the usual voltage feedback.
The use of the KH232 is basically the same as that of the
conventional op amp (see Figures 1 and 2). Since the
device is designed specifically for low gain applications,
the best performance is obtained when the circuit is used
at gains between ±1 and ±5. Additionally, performance is
optimum when a 250
feedback resistor is used.
Figure 1: Recommended non-inverting gain circuit
Figure 2: Recommended inverting gain circuit
Layout Considerations
To assure optimum performance the user should follow
good layout practices which minimize the unwanted
coupling of signals between nodes. During initial bread-
boarding of the circuit use direct point to point wiring,
keeping the lead lengths to less than 0.25”. The use of
solid, unbroken ground plane is helpful. Avoid wire-wrap
type pc boards and methods. Sockets with small, short
pin receptacles may be used with minimal performance
degradation although their use is not recommended.
During pc board layout keep all traces short and direct
The resistive body of Rg should be as close as possible
to pin 5 to minimize capacitance at that point. For the
same reason, remove ground plane from the vicinity of
pins 5 and 6. In other areas, use as much ground plane
as possible on one side of the board. It is especially
important to provide a ground return path for current from
the load resistor to the power supply bypass capacitors.
Ceramic capacitors of 0.01 to 0.1
f (with short leads)
should be less than 0.15 inches from pins 1 and 9.
Larger tantalum capacitors should be placed within one
inch of these pins. VCC connections to pins 10 and 12
can be made directly from pins 9 and 1, but better supply
rejection and settling time are obtained if they are
separately bypassed as in figures 1 and 2. To prevent
signal distortion caused by reflections from impedance
mismatches, use terminated microstrip or coaxial cable
when the signal must traverse more than a few inches.
Since the pc board forms such an important part of the
circuit, much time can be saved if prototype boards of any
high frequency sections are built and tested early in the
design phase.
Evaluation boards designed for either
inverting or non-inverting gains are available.
Offset Voltage Adjustment
If trimming of the input offset voltage (Vos = Vni -Vin) is
desired, a resistor value of 10k
to 1M placed between
pins 8 and 9 will cause Vos to become more negative by
8mV to 0.2mV respectively. Similarly, a resistor placed
between pins 1 and 2 will cause Vos, to become more
positive.
Thermal Considerations
At high ambient temperatures or large internal power
dissipations, heat sinking is required to maintain
acceptable junction temperatures. Use the thermal
model on the previous page to determine junction
temperatures. Many styles of heat sinks are available for
TO-8 packages; the Thermalloy 2240 and 2268 are good
examples. Some heat sinks are the radial fin type which
cover the pc board and may interfere with external
components. An excellent solution to this problem is to
use surface mounted resistors and capacitors.
They
have a very low profile and actually improve high
frequency performance. For use of these heat sinks with
conventional components, a 0.1” high spacer can be inserted
under the TO-8 package to allow sufficient clearance.
33
+15V
0.1
3.9
.01
Capactance in
F
1
12
5
3,7
RL
100
10
11
33
.01
0.1
3.9
-15V
9
+
-
KH232
Vo
Rf = 250
6
Rg
Vin
Ri
49.9
A
R
v
f
g
= 1+
250
33
+15V
0.1
3.9
.01
Capactance in
F
1
12
5
3,7
RL
100
10
11
33
.01
0.1
3.9
-15V
9
+
-
KH232
Vo
Rf = 250
For Zin = 50
, select
Rg || Ri = 50
6
100
Vin
Ri
250
Rg
A
R
v
f
g
=
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