
APPLICATION NOTES
Heat Sinking
To determine if a heat sink is necessary for your applica-
tion and if so, what type, refer to the thermal model and
governing equation below.
Governing Equation:
Example:
This example demonstrates a worst case analysis for
the op-amp output stage. This occurs when the output volt-
age is 1/2 the power supply voltage. Under this condition,
maximum power transfer occurs and the output is under
maximum stress.
Conditions:
VCC=±16VDC
VO=±8Vp Sine Wave, Freq.=1KHz
RL=100
For a worst case analysis we will treat the +8Vp sine
wave as an 8VDC output voltage.
1.) Find Driver Power Dissapation
PD=(VCC-VO) (VO/RL)
=
(16V-8V) (8V/100
)
=
0.64W
2.) For conservative design, set TJ=+125°C
3.) For this example, worst case TA=+50°C
4.) R
θJC=65°C/W from MSK 801 Data Sheet
5.) R
θCS=0.15°C/W for most thermal greases
6.) Rearrange governing equation to solve for R
θSA
Rev. B 6/04
3
TJ=PD x (R
θJC + RθCS + RθJC) + TA
Where
TJ=Junction Temperature
PD=Total Power Dissipation
R
θJC=Junction to Case Thermal Resistance
R
θCS=Case to Heat Sink Thermal Resistance
R
θSA=Heat Sink to Ambient Thermal Resistance
TC=Case Temperature
TA=Ambient Temperature
TS=Sink Temperature
Thermal Model:
APPROXIMATE
DESIRED GAIN
RI(+)
RI(-)
Rf
R1
Cf
1
-1
500
1K
1K
43
0.01f
+1
1K
0
0
43
0.01f
+5
0
910
3.6K
120
0.01f
1
910
1K
10K
150
0.01f
+10
-10
0
1K
9.1K
150
0.01f
Recommended External Component Selection
Guide Using External Rf
1
-5
820
1K
4.99K
120 0.01f
1 The positive input resistor is selected to minimize offset
currents. The positve input can be grounded without a
resistor if desired.
2 This feedback capacitor will help compensate for stray
input capacitance. The value of this capacitor can be
dependent on individual applications. A 2 to 9 pf capacitor
is usually optimum for most applications.
Load Considerations
When determining the load an amplifier will see, the
capacative portion must be taken into consideration. For
an amplifier that slews at 1000V/S, each pf will require 1
mA of output current. To minimize ringing with highly
capacitive loads, reduce the load time constant by adding
shunt resistance.
Case Connection
The MSK 801 has pin 8 internally connected to the
case. The case is not electrically connected to the internal
circuit. Pin 8 should be tied to a ground plane for shielding.
For special applications, consult factory.
R
θSA=((TJ-TA)/PD) - (RθJC) - (RθCS)
=
((125°C -50°C)/0.64W) - 65°C/W - 0.15°C/W
=
117.2 - 65.15
=
52.0°C/W
Stability and Layout Considerations
As with all wideband devices, proper decoupling of the
power lines is extremely important. The power supplies
should be bypassed as near to pins 10 and 12 as possible
with a parallel grouping of a 0.01f ceramic disc and a 4.7f
tantalum capacitor. Wideband devices are also sensitive
to printed circuit board layout. Be sure to keep all runs as
short as possible, especially those associated with the sum-
ming junction, power lines and compensation pins.