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參數(shù)資料
| 型號： | 5831-5003-10 |
| 英文描述： | OSX(MCX) Microminiature Snap-On Connectors Series |
| 中文描述： | OSX上器（MCX）超小型單元在連接器系列 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 441K |
| 代理商： | 5831-5003-10 |
M/A-COM, Inc.
North America: Tel. (800) 366-2266
Fax (800) 618-8883
I
Asia/Pacific:Tel. +85 2 2111 8088
Fax +85 2 2111 8087
I
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020
OSX
(MCX) Printed Circuit Board Receptacles
Decimal inch equivalents are shown in parentheses for general information only.
Recommended Mounting Pattern for
Microstrip Line
Part numbers 5862-5007-13 and 5864-5008-13 are designed
for surface mounting using infrared and vapor phase solder
techniques. Connector materials used include brass housings
and teflon dielectric support bushings which are compatible
with infrared and vapor phase soldering limits of 215° C.
The infrared soldering method should employ a convection
heating feature because of the shrouded center contact which
is inherent to the OSX straight coaxial connector design.
(Manual soldering techniques are not recommended because
of the physical connector housing-to-board spacing of
1.29mm (.051 inches).
The solder paste selection for reflow soldering techniques is
generally a function of components used on printed wire
board assembly. The metal content of the paste, for screening
stencil applications, is generally 85-90% by weight. Nozzle
dispensing techniques will have a slightly lower content.
Solder paste thickness of 0.15mm (.006 inches) to 0.25mm
(.010 inches) is recommended. Standard electrical grade
solders such as 63/37 (183C), 60/40 (190C) and 62/36/2
(189C) are used for most applications. These types of solder
employ a mild rosin/resin flux.
Notes:
1. Printed wiring board material: glass opoxy FR-4 or similar; relative
permittivity: 4.8, 1 oz. copper clad both sides.
2. These dimensions valid for 1.58 (.062) board thickness.
3. Decimal inch equivalents are shown in parentheses for general
information only.
8.89 (.350)
(5.08
(2.54
0.51 (4 PLCS
1.78 DI(.070)
1.27 (.050)
2.54 (.100)
4.45 (.175)
2.4 PLCS
1 oz. Copper
Area Free of Solder Mask
11.43 (.450)
5.72 (.225)
2.54 (.100)
5.08 (.200)
9.53 (.375)
Typical reflow temperature profiles
Typical Infrared and Convection Heating/Soldering Profile
Typical Vapor Phase Heating/Soldering Profile
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