參數(shù)資料
型號: 522981F
英文描述: Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
中文描述: 集成電路
文件頁數(shù): 8/8頁
文件大?。?/td> 216K
代理商: 522981F
8
LTC1483
LINEAR TECHNOLOGY CORPORATION 1994
LT/GP 1094 10K PRINTED IN THE USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7487
(408) 432-1900
G
FAX
: (408) 434-0507
G
TELEX
: 499-3977
APPLICATIU
Shutdown Mode
Both the receiver output (RO) and the driver outputs (A, B)
can be placed in three-state mode by bringing RE high and
DE low respectively. In addition, the LTC1483 will enter
shutdown mode when RE is high and DE is low.
In shutdown the LTC1483 typically draws only 1
μ
A of
supply current. In order to guarantee that the part goes
into shutdown, RE must be high and DE must be low for
at least 600ns simultaneously. If this time duration is less
U
W
U
than 50ns the part will not enter shutdown mode. Toggling
either RE or DE will wake the LTC1483 back up within
3.5
μ
s.
If the slow slew rate driver was active immediately prior to
shutdown, the supply current will not drop to 1
μ
A until the
driver outputs have reached a steady state; this can take as
long as 2.6
μ
s under worst case conditions. If the driver
was disabled prior to shutdown the supply current will
drop to 1
μ
A immediately.
RELATED PARTS
PART NUMBER
LTC485
LTC1480
LTC1481
LTC1485
LTC1487
DESCRIPTION
5V Low Power RS485 Interface Transceiver
3.3V Ultra-Low Power RS485 Transceiver
5V Ultra-Low Power RS485 Transceiver with Shutdown
5V Differential Bus Transceiver
5V Ultra-Low Power RS485 with Low EMI Shutdown
and High Input Impendance
COMMENTS
Low Power
World’s First 3V Powered 485 Transceiver with Low Power Consumption
Lowest Power
Highest Speed
High Input Impendance/Low EMI/Lowest Power
Dimension in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTIO
N
U
N Package
8-Lead Plastic DIP
N8 0695
0.005
(0.127)
MIN
0.100
±
0.010
(2.540
±
0.254)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130
±
0.005
(3.302
±
0.127)
0.015
(0.380)
MIN
0.018
±
0.003
(0.457
±
0.076)
0.125
(3.175)
MIN
1
2
3
4
8
7
6
5
0.255
±
0.015*
(6.477
±
0.381)
0.400*
(10.160)
MAX
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325–0.015
+0.635
–0.381
8.255
(
)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
1
2
3
4
0.150 – 0.157**
(3.810 – 3.988)
8
7
6
5
0.189 – 0.197*
(4.801 – 5.004)
0.228 – 0.244
(5.791 – 6.197)
0.016 – 0.050
0.406 – 1.270
0.010 – 0.020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
0.008 – 0.010
(0.203 – 0.254)
SO8 0695
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
BSC
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
S Package
8-Lead Plastic SOIC
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