- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄33877 > 514-AG10D-ESL DIP14, IC SOCKET PDF資料下載
參數(shù)資料
| 型號(hào)： | 514-AG10D-ESL |
| 元件分類： | 插座 |
| 英文描述： | DIP14, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大小： | 126K |
| 代理商： | 514-AG10D-ESL |
514-AG10D-ESL Product Details
514-AG10D-ESL
(1437801-6)
T E I nternal N umber: 1 4 3 7 8 0 1 -6
DIP Sockets
Product Highlights:
l
Socket Style = Standard
l
Through Hole Contact Termination Type
l
2.54 mm Centerline
l
Row-to-Row Spacing = 7.62 mm
l
14 Positions
Quick Links
Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Related Products:
l
Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
l
Socket Style = Standard
l
Number of Positions = 14
l
Profile = Standard
l
Frame Style = Closed
l
Leg Style = Straight
l
Sleeve Material = Machined brass/formed copper
l
Product Series = 500 Series
l
Comment = Economy Series
Electrical Characteristics:
l
Insulation Resistance (M?) = 5,000
l
Contact Resistance (m?) = 10
l
Contact Rating = 3A
Termination Related Features:
l
Termination Post Length (mm [in]) = 3.18 [0.125]
l
Solder Tail Contact Plating = Gold
Body Related Features:
l
Centerline (mm [in]) = 2.54 [0.100]
l
Row-to-Row Spacing (mm [in]) = 7.62 [0.300]
l
Mount Style = Vertical
Contact Related Features:
l
Contact Termination Type = Through Hole
l
Contact Base Material = Beryllium Copper
l
Contact Plating, Mating Area, Material = Gold Flash
l
Contact Style = Screw Machine
l
Mating Contact Type = Four-Fingered
Housing Related Features:
l
Housing Material = Thermoplastic - GF
l
Housing Flammability Rating = UL 94V-0
Configuration Related Features:
l
Height Above PC Board (mm [in]) = 4.57 [0.180]
Industry Standards:
l
RoHS/ELV Compliance = RoHS compliant, ELV compliant
l
Lead Free Solder Processes = Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C
l
RoHS/ELV Compliance History = Always was RoHS compliant
Conditions for Usage:
l
Temperature Range (?C) = -55 – +125
Operation/Application:
l
Application = Production
Packaging Related Features:
l
Packaging Method = Tube
l
Packaging Quantity = 34
Other:
l
Brand = AMP
Corporate Information
Quick Links
Customer Support
Search by Keyword or Part #
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 514-AG10D-ES | DIP14, IC SOCKET |
| 516-AG10D-ES | DIP16, IC SOCKET |
| 532-AG11D-ESL | DIP32, IC SOCKET |
| 514-AG11D-ESL | DIP14, IC SOCKET |
| 516-AG11D-ES | DIP16, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 514AG10F | 制造商:Thomas & Betts 功能描述: |
| 514-AG10F | 制造商:TE Connectivity 功能描述:DIP SOCKET, 14POS, THROUGH HOLE |
| 514-AG110ES | 制造商:AUGAT 功能描述: |
| 514-AG11D | 功能描述:IC 與器件插座 GOLD CNT TIN SLV 14P RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 514-AG-11D HSD | 制造商:TE Connectivity 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。