參數(shù)資料
型號: 5082-7300
英文描述: Hexadecimal and Numeric Indicators(十六進(jìn)制和數(shù)字指示器)
中文描述: 十六進(jìn)制的數(shù)值指標(biāo)(十六進(jìn)制和數(shù)字指示器)
文件頁數(shù): 1/2頁
文件大?。?/td> 34K
代理商: 5082-7300
Agilent 5082-7300, -7302, and -7340
Hexadecimal and
Numeric Displays
Reliability Data Sheet
Description
The following cumulative test
results have been obtained from
testing performed at Agilent
Technologies in accordance
with the latest revision of
MIL-STD-883.
Agilent tests parts at the absolute
maximum rated conditions
recommended for the device.
The actual performance you
obtain from Agilent parts
depends on the electrical and
environmental characteristics of
your application but will probably
be better than the performance
outlined in Table 1.
Failure Rate Prediction
The failure rate of semiconductor
devices is determined by the
junction temperature of the
device. The relationship between
ambient temperature and actual
junction temperature is given by
the following:
T
J
(
°
C) = T
A
(
°
C) +
θ
JA
P
AVG
where
T
A
= ambient temperature in
°
C
θ
JA
= thermal resistance of
junction-to-ambient in
°
C/watt
P
AVG
= average power dissipated
in watts
The estimated MTBF and failure
rate at temperatures lower than
the actual stress temperature can
be determined by using an
Arrhenius model for temperature
acceleration. Results of such
calculations are shown in the table
on the following page using an
activation energy of 0.43 eV
(reference MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Stress Test
Conditions
Total
Device Hrs.
Units
Tested
Units
Failed
[3]
Failure Rate
(% /1K Hours)
Test Name
MTBF
[1]
High Temperature
Operating Life
T
A
= +100
°
C,
V
CC
= 5.5 V
Numeric Cycling
514,000
514
0
514,000
0.195
Point Typical Performance
相關(guān)PDF資料
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5082-7304 Hexadecimal and Numeric Indicators(十六進(jìn)制和數(shù)字指示器)
5082-7340 Hexadecimal and Numeric Indicators(十六進(jìn)制和數(shù)字指示器)
5082-761X 7.6 mm (0.3 inch)/10.9 mm (0.43 inch) Seven Segment Displays(7.6 mm (0.3 英寸)/10.9 mm (0.43英寸) 七段顯示器)
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