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參數(shù)資料
| 型號： | 5082-2804 |
| 英文描述： | Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits |
| 中文描述： | PIN二極管的射頻衰減開關(guān)和肖特基二極管（57K PDF格式） |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 35K |
| 代理商： | 5082-2804 |
2-96
Electrical Specifications at T
A
= 25
°
C
Nearest
Chip
Equivalent
Part
Packaged
Number
Part No.
5082-
5082-
0001
3041
0012
3001
Test
Conditions
Typical Parameters
Typical
Reverse
Recovery
Time
t
rr
(ns)
5
100
I
F
= 20 mA
V
R
= 10 V
90% Recovery
Minimum
Breakdown
Voltage
V
BR
(V)
70
150
V
R
= V
BR
Measure
I
R
≤
10 mA
Maximum
Junction
Capacitance
C
j
(pF)
0.16*
0.12
V
R
= 50 V
*V
R
= 20 V
f = 1 MHz
Typical
Series
Resistance
R
S
(
)
0.8*
1.0
I
F
= 100 mA
*I
F
= 20 mA
f = 100 MHz
Typical
Lifetime
τ
(ns)
35*
400
I
F
= 50 mA
I
R
= 250 mA
*I
R
= 6 mA
*I
F
= 10 mA
Assembly and Handling
Procedures for PIN Chips
1. Storage
Devices should be stored in a dry
nitrogen purged dessicator or
equivalent.
2. Cleaning
If required, surface contamination
may be removed with electronic
grade solvents. Typical solvents,
such as freon (T.F. or T.M.C.),
acetone, deionized water, and
methanol, or their locally ap-
proved equivalents, can be used
singularly or in combinations.
Typical cleaning times per solvent
are one to three minutes. DI water
and methanol should be used (in
that order) in the final cleans.
Final drying can be accomplished
by placing the cleaned dice on
clean filter paper and drying with
an infrared lamp for 5-10 minutes.
Acids such as hydrofluoric (HF),
nitric (HNO
3
) and hydrochloric
(HCl) should not be used.
The effects of cleaning methods/
solutions should be verified on
small samples prior to submitting
the entire lot.
Following cleaning, dice should
be either used in assembly
(typically within a few hours) or
stored in clean containers in a
reducing atmosphere or a vacuum
chamber.
3. Die Attach
a. Eutectic
5082-0001
AuSn preform with stage tempera-
ture of 300
°
C for one minute max.
5082-0012
AuSn preform with stage tempera-
ture of 310
°
C for one minute max.
AuGe preform with stage tem-
perature of 390
°
C for one minute
max.
b. Epoxy
For epoxy die-attach, conductive
silver-filled or gold-filled epoxies
are recommended. This method
can be used for all Hewlett-
Packard PIN chips.
4. Wire Bonding
Either ultrasonic or thermo-
compression bonding techniques
can be employed. Suggested wire
is pure gold, 0.7 to 1.5 mil diam-
eter. Ultrasonic bonding method
should be avoided for the
5082-0001 diode chip.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 5082-2805 | PIN Diodes for RF Switching and Attenuating Schottky Diodes (57K in pdf) |
| 5082-2826 | Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits |
| 5082-2830 | Schottky Barrier Diode Quads for Double Balanced Mixers (48K in pdf) |
| 5082-2900SERIES | Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits |
| HDSP-3601 | 7.6 mm (0.3 inch) Seven Segment Displays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 5082-2805 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PIN Diodes for RF Switching and Attenuating Schottky Diodes (57K in pdf) |
| 5082-2810 | 功能描述:肖特基二極管與整流器 20 VBR 1.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| 5082-2810#T25 | 功能描述:肖特基二極管與整流器 20 VBR 1.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| 50822811 | 制造商:HP 功能描述:353-3691-050 制造商:n/a 功能描述:HP5082-2811 |
| 5082-2811 | 功能描述:肖特基二極管與整流器 15 VBR 1.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
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