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參數(shù)資料
| 型號(hào)： | 508-AG4F |
| 元件分類： | 插座 |
| 英文描述： | DIP8, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 115K |
| 代理商： | 508-AG4F |
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508-AG4F Product Details
Product Photo
508-AG4F
(9-1437529-5)
T E I nternal N umber: 9 -1 4 3 7 5 2 9 -5
DIP Sockets
Product Highlights:
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DIP Socket
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Number of Positions = 8
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Row-to-Row Spacing = 15.24 mm
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Through Hole Contact Termination Type
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Mount Style = Vertical
Quick Links
Documentation & Additional Information
Product Drawings:
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L.E.D. SOCKET ASSEMBLY (PDF, English)
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type = DIP Socket
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Profile = Standard
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Frame Style = Closed
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Leg Style = Wire Wrap
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Sleeve Material = Brass
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Product Series = 500 Series
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Comment = Three level solderless wrap type solder tail.
Electrical Characteristics:
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Insulation Resistance (M?) = 5,000
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Contact Resistance (m?) = 10
Termination Related Features:
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Termination Post Length (mm [in]) = 12.95 [0.510]
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Solder Tail Contact Plating = Tin-Lead
Body Related Features:
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Row-to-Row Spacing (mm [in]) = 15.24 [0.600]
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Mount Style = Vertical
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Centerline (mm [in]) = 2.54 [0.100]
Contact Related Features:
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Contact Termination Type = Through Hole
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Contact Base Material = Beryllium Copper
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Contact Mating Area Plating Material = Gold (25)
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Contact Style = Screw Machine
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Mating Contact Type = Four-Fingered
Configuration Related Features:
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Height Above PC Board (mm [in]) = 3.43 [0.135]
Industry Standards:
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RoHS/ELV Compliance = Not ELV/RoHS compliant
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Lead Free Solder Processes = Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C
Conditions for Usage:
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Temperature Range (?C) = 125
Packaging Related Features:
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Packaging Method = Tube
Other:
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Brand = AMP
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 9-1437529-9 | DIP24, IC SOCKET |
| 508-AG8D-3 | DIP24, IC SOCKET |
| 9-1437530-3 | SIP10, IC SOCKET |
| 9-1437531-9 | DIP22, IC SOCKET |
| 9-1437532-1 | DIP8, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 508-AG8D | 功能描述:IC 與器件插座 IC SOCKET 300 RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 508-AG8D-2E | 制造商:TE Connectivity 功能描述: |
| 508-AG8D-3 | 制造商:TE Connectivity 功能描述: |
| 508-AG8D-3E | 制造商:TE Connectivity 功能描述: |
| 50-8B/H17 | 功能描述:電容硬件 50-8B WSHR & NUT RoHS:否 制造商:Cornell Dubilier 系列: 產(chǎn)品: 封裝: |
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