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參數(shù)資料
| 型號(hào)： | 5-487576-0 |
| 廠商： | Tyco Electronics |
| 元件分類(lèi)： | SMT連接器& FFC/FPC |
| 英文描述： | .050 X .100 AMPMODU System 50 (Cable) |
| 中文描述： | .050 X .100 AMPMODU 系統(tǒng) 50（電纜） |
| 文件頁(yè)數(shù)： | 11/60頁(yè) |
| 文件大小： | 3240K |
| 代理商： | 5-487576-0 |
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43
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
AMPMODU Interconnection System
Board-to-Board
Connectors,
Surface-Mount
3
Product Facts
■ Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
■ Double row, vertical,
shrouded header and
receptacle assemblies
■ Available in select sizes
from 10 through 100
positions
■ High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
■ Compatible with standard
surface-mount processes
■ Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
■ Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
■ Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
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