參數(shù)資料
型號(hào)： 4606X-101-152
英文描述： WIDERSTAND NETZWERK DICKFILM 1K5 5ST
中文描述： WIDERSTAND NETZWERK DICKFILM 1K5 5ST
文件頁數(shù)： 58/62頁
文件大?。?/td> 1883K
代理商： 4606X-101-152
Specifications are subject to change without notice.
337
These are the common
methods, materials and
maximum temperature/
time parameters for
soldering and cleaning
processes:
Soldering/Cleaning Methods
REFLOW
FLOW
Hot Air,
Infrared
Vapor Phase
Wave
Process Step
(Solvent)
(Aqueous)
Material
1.
Solder Paste Printing
X
RMA
2.
Adhesive Application
X
Epoxy
3.
Switch Placement
X
4.
Adhesive Cure
X
5. Flux Application
X
Rosin
5. Flux Application
X
Organic Acid
6. Solder (Reflow)
X
63/37 Sn/Pb
7. Solder (Flow)
X
63/37 Sn/Pb
8. Wash (Solvent)
X
ODS Free
9. Wash (Aqueous)
X
DI H2O; Detergent
High Pressure Fluids
X
Ultrasonics
X
Max. Temp.(°C)/Time (Seconds)
240/30
215/180
260/5
6
Solder
Reflow; Convection,
IR and Vapor Phase
GENERAL
Preheat sufficiently using both time
and temp. to bring the flux to activa-
tion and minimize thermal shock.
Consult your solder paste supplier for
the recommended profile.
RECOMMENDED
Typical IR/Convection profile.
Use convection or Vapor Phase when
possible and minimize the time above
reflow temperature.
CAUTION
Do not exceed time and temperature
reflow profile of 240°C for 30 sec. for
Hot Air/IR reflow and 215°C for 3
minutes for vapor phase reflow.
Minimize thermal shock by limiting
temperature ramps to 3°C/sec. and by
stabilizing board and component tem-
perature during preheating.
7
Solder
Flow (Wave)
GENERAL
For maximum component reliability
and performance, minimize the time
of temp. exposure above 200°C.
RECOMMENDED
Typical alloy is Sn63/Pb37. A typical
wave solder zone profile is 245C for
5 sec.
CAUTION
Always preheat before the soldier
wave using the temperature for flux
activation recommended by the man-
ufacturer.
Do not exceed 240C peak tempera-
ture for dual wave solder process
with a flow zone totaling 5 seconds.
Minimize thermal shock by limiting
temperature ramps to 3C/sec. and by
stabilizing board and component
temperature during preheating.
8
Wash
Solvent
GENERAL
Use solvent cleaning primarily
for nonpolar contaminants
such as rosin based flux
residues.
RECOMMENDED
Use any suitable washing sol-
vents that meet ODS require-
ments.
CAUTION
Limit excessive direct spray
pressure to 60 psi.
Allow the assembly to suffi-
ciently cool prior to the wash-
ing operation for minimized
thermal stress.
9
Wash
Aqueous
GENERAL
Use aqueous cleaning primarily
for polar contaminants such as
organic flux residues.
RECOMMENDED
Use De-ionized or Reverse
Osmosis water with multistage
rinsing. Post bake at 100C for
30 minutes to remove any resid-
ual moisture.
CAUTION
Limit excessive direct spray
pressure to 60 psi.
Allow the assembly to sufficient-
ly cool prior to the washing oper-
ation for minimized thermal
stress.
Board Rework Technique
GENERAL
Excessive and/or repeated high
temperature exposure may
affect the component perfor-
mance and reliability.
RECOMMENDED
Hot air reflow technique is pre-
ferred. Use No Clean or Rosin
based fluxes only, OA fluxes are
recommended.
CAUTION
Avoid the use of wave soldering
or soldering irons as a rework
technique. Avoid repeated and
excessive temperature exposure.
PRE-HEATING
(in air)
SOLDERING GRADUAL COOLING
(in air)
200°C
100°C
0°C
ONE MINUTE
MIN.
20 SECOND
MAX.
230°C
PRE-HEATING
(in air)
SOLDERING GRADUAL COOLING
(in air)
200°C
100°C
0°C
ONE MINUTE
MIN.
5 SECOND
MAX.
245°C
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