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參數(shù)資料
| 型號： | 345719-6 |
| 元件分類： | 插座 |
| 英文描述： | DIP16, IC SOCKET |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 115K |
| 代理商： | 345719-6 |
Electronic Components | Segments | Who We Are
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345719-6 Product Details
Product Photo
345719-6
T E I nternal N umber: 3 4 5 7 1 9 -6
DIP Sockets
Product Highlights:
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DIP Socket
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Number of Positions = 16
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Row-to-Row Spacing = 7.62 mm
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Through Hole Contact Termination Type
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Mount Style = Vertical
Quick Links
Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type = DIP Socket
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Number of Positions = 16
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Profile = Standard
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Frame Style = Open
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Leg Style = Straight
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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Contact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in]) = 2.84 [0.112]
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Solder Tail Contact Plating = Tin-Lead over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in]) = 7.62 [0.300]
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Mount Style = Vertical
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Centerline (mm [in]) = 2.54 [0.100]
Contact Related Features:
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Contact Termination Type = Through Hole
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Contact Base Material = Beryllium Copper
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Contact Mating Area Plating Material = Gold Flash
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Contact Style = Screw Machine
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Mating Contact Type = Inner Spring
Configuration Related Features:
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Height Above PC Board (mm [in]) = 2.80 [0.110]
Industry Standards:
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RoHS/ELV Compliance = Not ELV/RoHS compliant
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Lead Free Solder Processes = Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Range (?C) = 105
Packaging Related Features:
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Packaging Method = Tube
Other:
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Brand = AMP
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