參數(shù)資料
型號(hào): 33702
廠商: Motorola, Inc.
英文描述: 3.0 A Switch-Mode Power Supply with Linear Regulator
中文描述: 3.0開(kāi)關(guān)模式電源,線性穩(wěn)壓器
文件頁(yè)數(shù): 18/24頁(yè)
文件大?。?/td> 841K
代理商: 33702
33702
18
Go to: www.freescale.com
Shorted Load
1.
V
OUT
shorted to ground.
The LDO uses method (1) and
(2) described in the
Methods of Control
section, page 16.
2.
LDO shorted to ground.
The switcher uses control
methods (4) and (5) described in the
Methods of Control
section, page 16.
3.
V
IN1
shorted to ground.
This is equivalent to the LDO
output shorted to ground.
4.
V
IN2
shorted to ground.
This is equivalent to the switcher
output shorted to ground.
5.
V
OUT
shorted to supply.
No load protection. 33702
protected by current limit and thermal limit.
6.
LDO shorted to supply.
No load protection. 33702
protected by current limit and thermal limit.
Inverted Operating Mode
1. Single 3.3 V Supply, V
IN
= V
IN1
= V
IN2
= 3.3 V
The 3.3 V supplies the microprocessor I/O voltage, the LDO
supplies core voltage (e.g., 1.8 V nominal), and the switcher
V
OUT
operates independently. Power sequencing depends only
on the normal LDO intrinsic operation to control the Pass FET.
Power Up
When V
IN
is rising, initially LDO will be below the regulation
point and the Pass FET will be on. In order not to exceed the
2.0 V differential requirement between the I/O (V
IN
) and the
core (LDO), the LDO must start up at 2.0 V or less and be able
to maintain the 2.0 V or less differential. The maximum slew
rate for V
IN
is 1.0 V/ms.
Power Down
When V
IN
is falling, LDO will be below the regulation point;
therefore the Pass FET will be on. In the case where LDO is
falling faster than V
IN
, the Pass FET will attempt to maintain
LDO. In the case where V
IN
is falling faster than LDO, the Pass
FET is also on, and the LDO load capacitor will be discharged
through the Pass FET to V
IN
. Thus, provided V
IN
does not fall
too fast, the core voltage (LDO) will not exceed the I/O voltage
(V
IN
) by more than maximum of 0.4 V.
Shorted Load
1.
LDO shorted to ground.
This will cause the I/O voltage to
exceed the core voltage by more than 2.0 V. No load
protection.
2.
V
IN
shorted to ground.
Until the LDO load capacitance is
discharged, the core voltage will exceed the I/O voltage
by more than 0.4 V. By the intrinsic operation of the LDO,
the load capacitor will be discharged rapidly through the
Pass FET to V
IN
.
3.
LDO shorted to supply.
No load protection.
2. Single 5.0 V Supply, V
IN1
= V
IN2
, or Dual Supply V
IN1
V
IN2
The switcher V
OUT
supplies the microprocessor I/O voltage.
The LDO supplies the core (e.g., 1.8 V nominal) (see
Figure 12
,
page 16).
Power Up
This condition depends upon the regulator current limit, load
IN1
and V
IN2
supplies. There are 2 cases:
1.
V
OUT
rises faster than LDO.
The switcher V
OUT
uses
control methods (4) and (5) described in the
Methods of
Control
section,
page 17.
2.
LDO rises faster than V
OUT
.
The LDO uses control
methods (1) and (2) described in the
Methods of Control
section,
page 17.
Power Down
This condition depends upon the regulator load current and
capacitance and the relative fall times of the V
IN1
and V
IN2
supplies. There are 2 cases:
1.
LDO falls faster than V
OUT
.
The V
OUT
uses control
methods (4) and (5) described in the
Methods of Control
section,
page 17.
In the case V
IN1
= V
IN2
the intrinsic operation will turn both
the Buck High-Side FET and the LDO external Pass FET,
and will discharge the V
OUT
load capacitor into the V
IN
supply.
2.
V
OUT
falls faster than LDO.
The LDO uses control
methods (1) and (2) described in the
Methods of Control
section,
page 17.
Shorted Load
1.
LDO shorted to ground.
The V
OUT
uses methods (4) and
(5) described in the
Methods of Control
section,
page 17.
2.
V
OUT
shorted to ground.
The LDO uses control methods
(1) and (2) described in the Methods of Control section.
3.
V
IN1
shorted to ground.
This is equivalent to the LDO
output shorted to ground.
4.
V
IN2
shorted to ground.
This is equivalent to the switcher
V
OUT
output shorted to ground.
5.
LDO shorted to supply.
No load protection.
6.
V
OUT
shorted to supply.
No load protection. 33702
protected by current limit and thermal limit.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
相關(guān)PDF資料
PDF描述
33742 System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver
33742S System Basis Chip (SBC) with Enhanced High-Speed CAN Transceiver
33793 Distributed System Interface (DSI) Sensor Interface
33887 5.0 A H-Bridge with Load Current Feedback
33888 Quad High-Side and Octal Low-Side Switch for Automotive
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
337-020-500-201 功能描述:標(biāo)準(zhǔn)卡緣連接器 GRN CRD EDGE .156X.2 PCB DEPTH .350 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold
337-020-500-202 功能描述:標(biāo)準(zhǔn)卡緣連接器 GRN CRD EDGE .156X.2 PCB DEPTH .350 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold
337-020-500-204 功能描述:標(biāo)準(zhǔn)卡緣連接器 GRN CRD EDGE .156X.2 PCB DEPTH .350 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold
337-020-500-802 功能描述:標(biāo)準(zhǔn)卡緣連接器 GRN CRD EDGE .156X.2 PCB DEPTH .350 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold
337-020-500-804 功能描述:標(biāo)準(zhǔn)卡緣連接器 GRN CRD EDGE .156X.2 PCB DEPTH .350 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold