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參數(shù)資料
| 型號(hào)： | 328-AG10DC |
| 廠商： | THOMAS BETTS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP28, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 51K |
| 代理商： | 328-AG10DC |
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
A8
A
Quality & Innovation From The
Product Group
300C Series Stamped Dual Wipe Contact DIP Sockets
FEATURES:
The Augat 300C Series dual wipe contact adds a new family of
product to Augat's low cost DIP socket line.
Closed bottom prevents solder wicking
Standoff's facilitate board cleaning
Low profile design
Recognized under the Component Program of Underwriters
Laboratories, Inc. File No. E111362
APPLICATION DIMENSIONS:
PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34))
PCB Hole Size Range: .035"
± .003" (0,89 ± 0,08) standard tail
IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through
.013" x .020" (0,33 x 0,51), .100" (2,54) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Contacts .......................... Phosphor bronze
Plating ............................ Tin/lead
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition III, 15 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition G, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 170 Grams (6.0 oz.) with .009" x .015"
(0,23 x 0,38) IC lead typ.
Contact Retention .......... 340 Grams (12.0 oz.) minimum
Solderability .................. Passed MIL-STD-202, Method 208
Insertion Force .............. 169 Grams (6.0 oz.) average with a .013"x .020"
(0,33 x 0,51) dia. polished steel pin
Withdrawal Force .......... 43 Grams (1.5 oz.) average with a .009" x .015"
(0,23 x 0,38) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 2 Amps
Capacitance .................... .5 pF per MIL-STD-202, Method 305
(Adjacent contacts max.)
Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1
Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1
Operation Temperature .. Gold -55
°C to +125°C
Tin -55
°C to +105°C
Salt Spray ...................... Passed MIL-STD-1344, Method 1001.1
328-AG19DC
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 320743-1 | 26.7 mm2, COPPER ALLOY, GOLD FINISH, RING TERMINAL |
| 320788 | 10.55 mm2, WIRE TERMINAL |
| 34306 | 1.4 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL |
| 34308 | 6 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL |
| 34308 | 6 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 328-AG19DC | 功能描述:IC 與器件插座 DISC MFG 8/01 SOCKET DIP 28 RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 328-AG19DCK | 制造商:AUGAT 功能描述: |
| 328-AG38D | 制造商:AUGAT COMPONENTS 功能描述: |
| 328-AG39D | 制造商:AUGAT COMPONENTS 功能描述: |
| 328-AG40D | 制造商:AUGAT COMPONENTS 功能描述: |
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