參數(shù)資料
型號： 2TSG256-713CGYC
廠商： ADVANCED INTERCONNECTIONS CORP
元件分類： 插座
英文描述： BGA256, IC SOCKET
文件頁數(shù)： 1/3頁
文件大?。?/td> 120K
代理商： 2TSG256-713CGYC
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
REV. 8/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
True BGA Socket Features
No soldering of BGA device required.
AIC exclusive eutectic solder ball
terminals offer superior processing.
Uses same footprint as BGA device.
Designed for production, develop-
ment, programming and test applica-
tions.
Compact design maximizes PCB real
estate:
TSG = Device Pkg. Size + 0.216/(5.5mm)
TSH = Device Pkg. Size + 0.374/(9.5mm)
Available with integral, finned heat
sink or coin screw clamp assembly.
Currently available in 1.0 and
1.27mm pitch.
New Short Slide Clamp reduces
required installation space on PCB.
Specifications
Terminals: Brass; Copper Alloy
(C36000)
Terminal Support: Polyimide Film
Contacts: Beryllium Copper (C17200)
Plating: G – Gold over Nickel
Spring Material: Beryllium Copper
Clamp Assembly: Aluminum
(Heat Sink/Coin Screw, Clamp, Support Plate)
Insulator Material:
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60
°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183
°C (361°F)
True BGA Socket
Ball Grid Array Sockets
Type -690
Surface Mount
Type -708
Thru-Hole
Standard Terminals
for Test, Development and Production Applications
.183
(4.65)
.125
(3.18)
.018 Dia.
(0.46)
.183
(4.65)
.030 Dia.
(0.76)
Type -712
Type -713
Terminals for LGA or
De-balled BGA Device Applications
.030 Dia.
(0.76)
.193
(4.90)
.193
(4.90)
.125
(3.18)
.018 Dia.
(0.46)
Type -657
Type -709
Type -659
Terminals for BGA Device Test Applications
(Consult Factory for Availability)
.183
(4.65)
.125
(3.18)
.018 Dia.
(0.46)
.183
(4.65)
.125
(3.18)
.016 Dia.
(0.41)
.030 Dia.
(0.76)
.183
(4.65)
How It Works
Step 1
Solder True BGA Socket to PCB
Step 2
Align and place BGA device on top
of True BGA Socket mating con-
tacts. Place Chip Support Plate
over BGA device.
Step 3
Slide Clamp over assembly. Allow
space on PCB for sliding clamp
[approximately 33% of device
package size on one side only with
new Short Slide Clamp]. Refer to
Clamp Sliding Directions for pin 1
location (see page 4).
Step 4
Tighten Coin Screw or Finned Heat
Sink to engage compression stroke.
Support Plate
BGA Device
Solder Ball
Reflowed
P.C.B.
ADVANCED
Compression
Stroke (Step 4)
Polyimide
Wafer
Guide Box
Heat Sink Clamp
Coin Screw
or Finned
Heat Sink
P.C.B.
ADVANCED
BGA
How To Order
Number of Positions
*See BGA Footprint Booklet
or web site
X
TS G XXXX - 690 G G XX
True BGA Socket
Pitch
G = .050/(1.27mm) pitch
H = .039/(1.0mm) pitch
Terminal Plating
G - Gold
Contact Plating
G - Gold
Clamp Options
YH - Heat Sink (3 Fins Std.)
YC - Coin Screw
Terminal Type
See options above
Footprint Dash #
If Applicable*
1.27mm Pitch Terminal Options
Support Plate
Not Shown
Mechanical specifications for BGA device package required for quoting/ordering.
PATENTED
.024/(0.61) Dia.
.162
(4.11)
.125
(3.18)
.011 Dia.
(0.28)
Type -752
Surface Mount
Type -754
Thru-Hole
1.0mm Pitch Terminals
for Test, Development and Production Applications
.162
(4.11)
5
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