參數(shù)資料
型號： 2MBI200TA-060
廠商： FUJI ELECTRIC CO LTD
元件分類： IGBT 晶體管
英文描述： IGBT Module
中文描述： 200 A, 600 V, N-CHANNEL IGBT
封裝： MODULE-7
文件頁數(shù)： 4/14頁
文件大?。?/td> 589K
代理商： 2MBI200TA-060
H04-004-03
14
MS5F 5291
4
3. Absolute Maximum Ratings ( at Tc= 25
℃
unless otherwise specified
）
Items
Symbols
Conditions
Maximum
Ratings
600
±20
200
400
200
400
780
150
-40~ +125
2500
3.5
3.5
Units
Collector-Emitter voltage
Gate-Emitter voltage
VCES
VGES
Ic=1mA
V
V
Ic
Duty=100 %
1ms
Duty=50 %
1ms
1 device
Collector current
Ic pulse
IF
IF pulse
Pc
Tj
Tstg
Viso
Mounting
(*2)
Terminals
(*2)
A
Collector Power Dissipation
Junction temperature
Storage temperature
Isolation voltage
(*1)
W
℃
℃
V
AC : 1min.
Screw Torque
N
m
(*1) All terminals should be connected together when isolation test will be done.
(*2) Recommendable Value : Mounting 2.5~3.5 N
m (M5)
Terminal 2.5~3.5Nm (M5)
4. Electrical characteristics ( at Tj= 25
℃　
unless otherwise specified)
Characteristics
Items
Symbols
Conditions
min.
typ.
Max.
Units
Zero gate voltage
Collector current
Gate-Emitter leakage current
Gate-Emitter
threshold voltage
Collector-Emitter
saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
I
CES
V
GE
=
0 V,
V
CE
=
600 V
-
-
2.0
mA
I
GES
V
CE
=
0 V,
V
GE
=
±20 V
-
-
400
n
A
V
GE(th)
V
CE
=
20 V,
Ic =
200 mA
6.2
6.7
7.7
V
VCE(sat)
V
GE
=
15 V
200 A
0 V
10 V
1 MHz
300 V
Chip
Terminal
-
-
-
-
-
-
1.6
1.8
20000
3600
3100
0.6
-
V
Ic =
VGE =
2.4
-
-
-
1.2
Cies
Coes
Cres
ton
V
CE
=
f =
Vcc =
pF
Turn-on time
tr
tr
(i)
toff
tf
Ic =
V
GE
=
R
G
=
200 A
±15 V
16
:
-
-
-
-
-
-
-
0.3
0.1
0.6
0.05
1.75
2.0
-
0.6
-
1.2
0.45
-
2.5
0.3
μ
s
Turn-off time
Forward on voltage
V
F
I
F
=
200 A
Chip
Terminal
V
Reverse recovery time
Allowabe avalanche energy
during short circuit cutting off
(Non-repetitive)
trr
IF =
200 A
μ
s
P
AV
Ic > 400A, Tj = 125
℃
140
-
-
mJ
5. Thermal resistance characteristics
Characteristics
Items
Symbols
Conditions
min.
typ.
Max.
Units
Thermal resistance
R
th(j-c)
IGBT
FWD
With thermal compound
※
-
-
-
-
-
0.160
0.51
-
(1 device)
℃
/
Ｗ
Contact Thermal resistance
* This is the value which is defined mounting on the additional cooling fin
with thermal compound.
R
th(c-f)
0.025
a
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