參數(shù)資料
型號： 293D107X9010D2W
廠商： Vishay Intertechnology,Inc.
英文描述： Solid Tantalum Chip Capacitors TANTAMOUNT, Commercial, Surface Mount
中文描述： 固體鉭電容器芯片無異，商業(yè)，表面貼裝
文件頁數(shù)： 12/13頁
文件大?。?/td> 160K
代理商： 293D107X9010D2W
www.vishay.com
26
293D
Vishay Sprague
Document Number 40002
Revision 27-Oct-04
For technical questions, contact tantalum@vishay.com
9.
Recommended Mounting Pad Geometries
: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework
due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for
both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board
design.
Wave Solder Pads
Reflow Solder Pads
Pad Dimensions
B
(Nom.)
0.085
[2.15]
Case
Code
A
A
(Min.)
0.034
[0.87]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.061
[1.54]
0.061
[1.54]
0.066
[1.68]
0.066
[1.68]
0.034
[0.87]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
B
C
D
E
P
A
(Min.)
0.071
[1.80]
B
(Nom.)
0.085
[2.15]
C
(Nom.)
0.053
[1.35]
D
(Nom.)
0.222
[5.65]
E
(Nom.)
0.048
[1.23]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
0.071
[1.80]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
D
A
C
B
E
Pad Dimensions
D
B
A
E
C
Case
Code
A
B
C
D
E
P
GUIDE TO APPLICATION
(Continued)
Recommended Solder Profile
—
Wave Solder
Recommended Solder Profile
—
Reflow
T
300
250
200
150
100
50
0
300
250
200
150
100
50
0
0 50 100 150 200 250
Time (Seconds)
245
°
C Typical
130
°
C Typical
Time (Seconds)
300
250
200
150
100
50
0
0 50 100 150 200 250
300
250
200
150
100
50
0
Max. Recommended
260
°
C
130
°
C
5 - 10 Sec.
T
SOLDERING PROFILE
RECOMMENDED MOUNTING PAD GEOMETRIES
in inches [millimeters]
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293D107X9010D8T 功能描述:鉭質(zhì)電容器-固體SMD 100uF 10volts 10% D case Molded RoHS:否 制造商:AVX 電容:100 uF 電壓額定值:20 V ESR: 容差:10 % 外殼代碼 - in:2917 外殼代碼 - mm:7343 高度:4.1 mm 制造商庫存號:E Case 工作溫度范圍:- 55 C to + 125 C 系列:TBM 產(chǎn)品:Tantalum Solid Low ESR Commercial Grade 封裝:Bulk
293D107X9010D8W 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Solid Tantalum Surface Mount Chip Capacitors
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