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參數(shù)資料
| 型號： | 25AA080B |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | LED IR 890NM PLASTIC SIDELOOK |
| 中文描述： | 8K的SPI總線串行EEPROM |
| 文件頁數(shù)： | 18/24頁 |
| 文件大?。?/td> | 523K |
| 代理商： | 25AA080B |
25XX080A/B
DS21808B-page 18
2003 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.30
0.25
0.19
.012
.010
.007
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
0.70
0.60
0.50
.028
.024
.020
L
Foot Length
3.10
3.00
2.90
.122
.118
.114
D
Molded Package Length
4.50
4.40
4.30
.177
.173
.169
E1
Molded Package Width
6.50
6.38
6.25
.256
.251
.246
E
Overall Width
0.15
0.10
0.05
.006
.004
.002
A1
Standoff
§
0.95
0.90
0.85
.037
.035
.033
A2
Molded Package Thickness
1.10
.043
A
Overall Height
0.65
.026
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
Foot Angle
φ
0
4
8
0
4
8
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
§ Significant Characteristic
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 25AA080BMS | PHOTOTRANSISTOR IR 3MM 935NM NPN |
| 25AA080BP | PHOTOTRANSISTOR 3MM 935NM NPN |
| 25AA080BSN | PHOTOTRANSISTOR 3MM 935NM NPN |
| 25AA080BST | PHOTOTRANSISTOR NPN OPAQUE 1206 |
| 25LC080B | 8K SPI Bus Serial EEPROM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 25AA080B-E/MS | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080B-E/MSG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080B-E/P | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080B-E/PG | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080B-E/SN | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
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