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參數(shù)資料
| 型號(hào)： | 256LBGA |
| 廠商： | SMSC Corporation |
| 英文描述： | 256 LBGA/LBGN PACKAGE OUTLINE |
| 中文描述： | 256采用LBGA / LBGN封裝外形 |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 84K |
| 代理商： | 256LBGA |
256 LBGA/LBGN PACKAGE OUTLINE
SINGLE (LID) MOLDED
MATRIX MOLDED & SAWED
Min
1.10
0.25
0.49
16.80
-
14.80
16.80
-
14.80
0.40
Nominal
-
-
-
17.00
15.00
15.00
17.00
15.00
15.00
0.50
1.00 Basic
-
Max
1.50
0.50
0.75
17.20
-
15.20
17.20
-
15.20
0.70
Remark
A
A1
A2
D
D1
D2
E
E1
E2
b
e
ccc
Overall Package Height
Standoff
Mold Thickness
X Board Length
X Distance Between End Ball Centers
X Lid Length (see Note 4)
Y Board Length
Y Distance Between End Ball Centers
Y Lid Length (see Note 4)
Ball Diameter
Pitch
Coplanarity
-
0.20
Notes:
1. Controlling Unit: millimeter.
2. Maximum radial true position tolerance of each ball is 0.125 mm at maximum material condition. Dimension
"b (max)" is 0.70mm for all devices, which start production after 2004, and is 0.60mm for all devices, which
started production prior to 2005, until the end of their product life.
3. Details of ball A1 identifier are optional but must be located within the zone indicated.
4. Single molded (Lid) version of the package is optional - see dashed line.
5. Provided for reference only - contact your SMSC Regional Sales Office for latest information.
Rev. 8/23/05
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
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