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參數(shù)資料
| 型號： | 24C1024 |
| 廠商： | Atmel Corp. |
| 英文描述： | 2-wire Serial EEPROM 1M (131,072 x 8) |
| 中文描述： | 2線串行EEPROM 100萬（131072 × 8） |
| 文件頁數(shù)： | 16/19頁 |
| 文件大?。?/td> | 291K |
| 代理商： | 24C1024 |
16
AT24C1024
1471H–SEEPR–03/03
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3
, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
8P3
R
REV.
01/09/02
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A
0.210
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
3
D1
0.005
3
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
e
0.100 BSC
eA
0.300 BSC
4
L
0.115
0.130
0.150
2
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