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參數(shù)資料
| 型號： | 24C01SC-WF |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST |
| 中文描述： | 24C01C磷24C01C的IP 24C01C -內啡肽24C01C錫24C01C，無法真正傳達24C01C - ESN的24C01C ST段24C01C -北京時間24C01C -學報 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 168K |
| 代理商： | 24C01SC-WF |
1999 Microchip Technology Inc.
DS21170D-page 9
24C01SC/02SC
7.0
PAD DESCRIPTIONS
7.1
SDA Serial Address/Data Input/Output
This is a bi-directional pad used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to V
CC
(typical 10K for 100 kHz, 2 K for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the START and STOP condi-
tions.
7.2
SCL Serial Clock
This input is used to synchronize the data transfer from
and to the device.
7.3
DC Don’t Connect
This pad is used for test purposes and should not be
bonded out. It is pulled down to V
SS
through an internal
resistor.
8.0
DIE CHARACTERISTICS
Figure 8-1 shows the die layout of the 24C01SC/02SC,
including bondpad positions. Table 8-1 shows the
actual coordinates of the bondpad midpoints with
respect to the center of the die.
FIGURE 8-1:
DIE LAYOUT
TABLE 8-1:
BONDPAD COORDINATES
Pad Name
Pad Midpoint,
X dir.
-495.000
-605.875
479.875
605.875
Pad Midpoint,
Y dir.
749.130
-271.875
-746.625
-261.375
V
SS
SDA
SCL
V
CC
Note 1: Dimensions are in microns.
2: Center of die is at the 0,0 point.
DIP
SDA
DC
V
CC
SCL
V
SS
This Material Copyrighted by Its Respective Manufacturer
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相關代理商/技術參數(shù) |
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| 24C01SCWF08 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM |
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| 24C02 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:24C01C-P 24C01C-IP 24C01C-EP 24C01C-SN 24C01C-ISN 24C01C-ESN 24C01C-ST 24C01C-IST 24C01C-EST |
| 24C02/P | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| 24C02-2P | 制造商:Integrated Silicon Solution Inc 功能描述: |
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