參數(shù)資料
型號: 23986
英文描述: Active High 3.3V EconoReset
中文描述: Socket A平臺AMD處理器和散熱器安裝指南
文件頁數(shù): 9/20頁
文件大小: 1086K
代理商: 23986
9
23986—December 2000
Socket A AMD Processor Installation Guide
9. Figure 9 shows the proper way to remove the plastic film from the phase-change
thermally conductive compound.
Note:
The phase-change thermal compound is very important to the efficiency and
success of the heatsink. The compound must be applied evenly to the surface of the
heatsink so it can (basically) melt and fill any microscopic voids in the surfaces of the
processor and heatsink with a thermally conductive material.
Caution:
If you have never installed a heat sink with this type of phase-change
thermal material, we suggest that you not remove this film until after you have
practiced installing the heatsink and mounting the clips on the socket. It may take a
few trials until you are familiar with the procedure. If you want to become familiar
with the process, skip the tape removal step for now and proceed to repeat Step 10
through Step 19.
Notice in Figure 9 that the film is removed by pulling rapidly at a right angle to
the base. A quick lifting motion is the best way to remove this film. Be aware that:
Once the film is removed, immediately install the heatsink.
The thermal compound must not come in contact with any foreign material.
Caution:
Do not remove the heatsink from the processor, once it has been
permanently installed. The phase-change thermal adhesive material cannot be
reused.
Remove the plastic film completely from the heatsink during the installation
to avoid causing the processor to overheat and be damaged when power is applied.
Pay strict attention to the procedures outlined in this document to avoid missing a
crucial step
.
Figure 9. Pull Tape from Thermal Material with a Quick Motion
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