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參數(shù)資料
| 型號(hào)： | 232266197016 |
| 廠商： | Vishay Intertechnology,Inc. |
| 元件分類： | 熱敏電阻 |
| 英文描述： | Surface Mount PTC Thermistors For Overload Protection |
| 中文描述： | 表面貼裝PTC熱敏電阻為過載保護(hù) |
| 文件頁數(shù)： | 2/4頁 |
| 文件大小： | 109K |
| 代理商： | 232266197016 |
2322 661 97...
Vishay BCcomponents
Surface Mount PTC Thermistors
For Overload Protection
www.vishay.com
148
For technical questions contact: nlr.europe@vishay.com
Document Number: 29068
Revision: 10-Oct-03
DIMENSIONS
in millimeters
MATERIAL INFORMATION
REF.
DESCRIPTION
MATERIAL AND REMARKS
1
ceramic
BaTiO3 doped
2
metallization
NiCr Ag layer
(vacuum deposition)
3
leadframe
Ni plated phosphor bronze material
covered by PbSn8 solder layer
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a re-inforced version is available on request.
PTC OUTLINES
PTC SMD ceramic size: 6.5 mm.
3.6
±
0.1
10
±
0.25
8.0
2.8
2
4
±
0.1
4
±
0.2
0.2
°
10
1
7.6
±
0.25
0.6
+
0.6
0
7.2
0
0.2
3.45
±
0.15
1.2
For electrical data, see Electrical Data
and Ordering Information table.
Product outline. See Material Information table.
3
2
2
3
1
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with
used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
“CECC 00802”
. Soldering processes which can be
°
C during 10 s should
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering.
Typical values (solid line).
Process limits (dotted lines).
0
50
100
150
200
250
300
250
200
150
100
50
0
10 s
260 C
245 C
130 C
( C)
t (s)
215 C
180 C
10 s
40 s
2 K/s
T
0
50
100
150
200
250
300
250
200
150
100
50
0
( C)
t (s)
215 C
180 C
20 to 40 s
internal preheating,
e.g. by infrared,
max. 2 K/s
100 C
130 C
external preheating
forced
cooling
T
Typical values (solid line).
Process limits (dotted line).
Vapour phase soldering.
11
5
2
Dimensions of the solder lands in millimeters
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