參數(shù)資料
型號: 22921C1
英文描述: Migrating between Flash Device Densities
中文描述: 遷移之間的Flash器件密度
文件頁數(shù): 7/17頁
文件大?。?/td> 125K
代理商: 22921C1
14
Migrating Between Flash Device Densities
48- OR 63-BALL FBGA: 3 V X8-ONLY DEVICES
2
3
4
5
6
7
8
1
2
3
4
5
6
1
CD
AB
E
F
G
H
J
K
L
M
CD
AB
E
F
G
H
NC*
NC
A20
VSS
A17
A16
A15
A13
A14
DQ6
DQ7
A10
A19
A12
A11
A8
A9
VCC
DQ4
NC
DQ5
NC
RESET#
WE#
DQ3
DQ2
A20
NC
RY/BY#
NC
DQ1
NC
DQ0
A5
A6
A18
A7
OE#
VSS
CE#
A0
A1
A2
A4
A3
Am29LV017D
Am29LV033C
Am29LV065D
NC
ACC
NC
A22
VCC
VIO
NC
A21
Package Body
8 x 9 mm
8 x 14 mm
Ball Grid Array
48 balls
63 balls
3 V
Standard
63-ball Grid Array
48-ball Grid Array
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch.
* Balls are shorted together via the substrate but not connected to the die.
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