參數(shù)資料
型號(hào): 21C02SC
廠商: Microchip Technology Inc.
英文描述: 2K 5.0V IIC serial EEPROMs for smart card(2K位,5.0V,ISO7816標(biāo)準(zhǔn),EEPROM)
中文描述: 2K 5.0V進(jìn)口證的智能卡(2K位和5.0V,符合ISO7816標(biāo)準(zhǔn),EEPROM的串行EEPROM)
文件頁(yè)數(shù): 8/12頁(yè)
文件大?。?/td> 84K
代理商: 21C02SC
24C01SC/02SC
DS21170A-page 8
Preliminary
1996 Microchip Technology Inc.
8.0
PAD DESCRIPTIONS
8.1
SDA Serial Address/Data Input/Output
This is a bi-directional pad used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to V
CC
(typical 10K
for 100 kHz, 1K
for 400
kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are reserved
for indicating the START and STOP conditions.
8.2
SCL Serial Clock
This input is used to synchronize the data transfer from
and to the device.
8.3
DC Don’t Connect
This pad is used for test purposes and should not be
bonded out. It will be pulled to V
SS
through an internal
resistor.
9.0
DIE CHARACTERISTICS
Figure 9-1 shows the die layout of the 24C01SC/02SC,
including bondpad positions. Table 9-1 shows the
actual coordinates of the bondpad midpoints with
respect to the center of the die.
FIGURE 9-1:
DIE LAYOUT
TABLE 9-1:
BONDPAD COORDINATES
Pad Name
Pad Midpoint,
X dir.
-495.000
-605.875
479.875
605.875
Pad Midpoint,
Y dir.
749.130
-271.875
-746.625
-261.375
V
SS
SDA
SCL
V
CC
Note 1: Dimensions are in microns.
2: Center of die is at the 0,0 point.
DIP
SDA
DC
V
CC
SCL
V
SS
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