參數(shù)資料
型號(hào): 21-0056C
廠商: Maxim Integrated Products, Inc.
英文描述: PACKAGE OUTLINE, SSOP, 5.3 MM
中文描述: 封裝外形,SSOP封裝,5.3毫米
文件頁數(shù): 1/1頁
文件大小: 17K
代理商: 21-0056C
PACKAGE OUTLINE, SSOP, 5.3 MM
1
1
21-0056
C
REV.
DOCUMENT CONTROL NO.
APPROVAL
PROPRIETARY INFORMATION
TITLE:
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
3. CONTROLLING DIMENSION: MILLIMETERS.
4. MEETS JEDEC MO150.
5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
7.90
0.95
H
L
0.301
0.025
0.311
0.037
7.65
0.63
MAX
5.38
MILLIMETERS
B
C
D
E
e
A1
DIM
A
SEE VARIATIONS
0.0256 BSC
0.010
0.004
0.205
0.002
0.015
0.008
0.212
0.008
INCHES
MIN
0.068
MAX
0.078
0.65 BSC
0.25
0.09
5.20
0.05
0.38
0.20
0.21
MIN
1.73
1.99
MILLIMETERS
MIN
6.07
6.07
7.07
10.07
8.07
INCHES
MIN
D
D
D
D
D
0.239
0.239
0.278
0.397
0.317
0.249
0.249
0.289
0.407
0.328
MAX
6.33
6.33
7.33
10.33
8.33
14L
16L
20L
28L
24L
MAX
N
A
D
e
A1
L
C
H
E
N
1
2
B
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