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參數(shù)資料
| 型號： | 1888251-4 |
| 廠商： | Tyco Electronics |
| 元件分類： | PCB用連接器 |
| 英文描述： | Multi–Port PCB Modular Jacks |
| 中文描述： | Multi–Port PCB Modular Jacks |
| 文件頁數(shù)： | 16/32頁 |
| 文件大?。?/td> | 2909K |
| 代理商： | 1888251-4 |
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23
Catalog 3-1773445-8
Dimensions are in millimeters
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 6-07
and inches unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
are U.S. equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Product Compliant to xTCA or AdvancedMC Specifications (Continued)
Solutions for AdvancedTCA, AdvancedTCA 300,
MicroTCA, and AdvancedMC Standards
AdvancedMC, AdvancedTCA, AdvancedTCA 300, MicroTCA and PICMG are trademarks
of PICMG-PCI Industrial Computer Manufacturers Group Incorporated.
Thermal Interface Products are mandatory
for reducing the waste heat and cooling
the system in the most efficient way. Waste
heat reduces the silicon chip reliability and
performance. In addition to the products
Tyco Electronics is offering such as Heat
Sinks, Heat Pipes and CHIP COOLERs,
in all shapes and sizes, Tyco Electronics
offers state of the art Thermal Management
Services. Thermal Management is the
design practice of moving waste heat to
locations that do not affect the equipment or
overall device performance. Each Thermal
Product can be fully customized
to fulfill the specific requested system
cooling requirements.
Catalog 1309431
Flyer 1308225
AdvancedTCA — Thermal Products & Services
FEATURES
Tyco Electronics thermal solutions
provide
optimum
cooling
for
active components like BGA (Ball
Grid Array), MCM modules, opti-
cal modules and power devices
Compatible to most AdvancedTCA
connector
form
factors,
low
profile solutions
Off the shelf as well as customized
products
Heat pipe technology in combin-
ation with passive heat sinks
Advanced
thermal
conductive
polymer for weight and cost
reduction
Full CFD (Computational Fluid
Dynamics) simulation and analy-
sis, optimum Thermal design
numerical
and
analytical
approaches
Tyco Electronics’ MRJ21 receptacle is a
high density I/O interconnect. This high
density connector supports AdvancedMC
Mid-size and Full-size module face plates
and AdvancedTCA face plates. It can also
be used for Rear I/O via Rear Transition
Modules (RTMs), as well as in
AdvancedTCA Zone 3 applications.
The MRJ21 connector is fully shielded and
provides density savings for current 10/100
or GbE RJ45/RJ21 applications. The low
profile and narrow width design will allow
more ports to be packed into less space.
Tyco Electronics offers a full end-user
solution with cleaner cabling solutions over
RJ45s, and patch panels for plug-and-play
environment, including data centers and
zone cabled or open office environments.
AdvancedTCA — Front & Rear I/O Connectors — MRJ21 Receptacles
FEATURES
1.5 to 3 times the port density
of stacked Mod Jacks (RJ45).
3 times the port density of RJ21
Contact layout and footprint for
differential pairs creates reduced
cross-talk and built in compensa-
tion
Connector is designed to meet or
exceed Cat 5e cross-talk
Fully
shielded
system
to
control
EMI
(Electro-magnetic
Interference)
Robust die cast cable covers pro-
vide 45 degrees left or right cable
exit for ease of routing
1 mm pair spacing, 1.5 mm pair
to pair spacing
Patch panels and cable manage-
ment solutions available
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MRJ21 PCB Receptacles (48-position)
Part Number
Panel
PCB
Grounds
Termination
1761482-1
No
Solder
1761482-2
Yes
Solder
1761482-4
No
Press-Fit
Screwlocks sold separately
Receptacle Screwlocks
Part Number
Panel
Thickness
1339381-1
< 1mm
1339381-2
> 1mm to
< 2mm
Note: Part Numbers are RoHS compliant.
相關PDF資料 |
PDF描述 |
|---|---|
| 1888652-1 | Stacked PCB Modular Jacks |
| 1888652-2 | Stacked PCB Modular Jacks |
| 1888653-1 | Stacked PCB Modular Jacks |
| 1888653-2 | Stacked PCB Modular Jacks |
| 1888653-3 | Stacked PCB Modular Jacks |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 188825F00000G | 功能描述:INSULATOR RoHS:否 類別:風扇，熱管理 >> 熱 - 墊，片 系列:In-Sil-8 標準包裝:1 系列:Apex Precision Power® 使用:12-PowerSIP 形狀:矩形 外形:34.54mm x 18.54mm 厚度:0.002"（0.051mm） 材質(zhì):Kapton® MT 膠合劑:相變化合物 背襯，載體:- 顏色:棕褐 熱電阻系數(shù):- 導熱性:- 其它名稱:598-1381Q6572299 |
| 188826-4 | 制造商:TE Connectivity 功能描述:31P.IEC-F FEM.CONN 制造商:TE CONNECTIVITY 功能描述:31P.IEC-F FEM.CONN |
| 1888275-1 | 制造商:TE Connectivity 功能描述:CONN ACC 33 POS PCMCIA TOP COVER - Bulk 制造商:TE Connectivity 功能描述:PC Card (PCMCIA) Connectors & Accessories |
| 1888276 | 功能描述:固定接線端子 FFKDSA1/V-2.54-9 RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Fixed Terminal Blocks 類型:Wire to Board 節(jié)距:5.08 mm 位置/觸點數(shù)量:2 線規(guī)量程:26-16 電流額定值:13.5 A 電壓額定值:250 V 安裝風格:Through Hole 安裝角:Straight 端接類型:Screw 觸點電鍍: |
| 1888276-1 | 制造商:TE Connectivity 功能描述:FRAME,TYPE II,MEMORY CARD - Bulk |
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