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參數(shù)資料
| 型號(hào)： | 1812H1000682MCTE03 |
| 廠商： | SYFER TECHNOLOGY LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 2 FUNCTIONS, 100 V, FEED THROUGH CAPACITOR |
| 封裝： | EIA STD PACKAGE SIZE 1812 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 445K |
| 代理商： | 1812H1000682MCTE03 |
Ordering information
1812
Y
100
0334
M
X
T
E03
Chip Size Termination
Voltage
Capacitance in picofarads (pF) C1 Tolerance Dielectric
Packaging
Type
0603
0805
1206
1410
1812
2220
J = Nickel
barrier
Y = FlexiCap
A = (Tin/lead)
H = FlexiCap
(Tin/lead)
16 = 16Vdc
25 = 25Vdc
50 = 50Vdc
100 = 100Vdc
First digit is 0. Second and third digits
are significant figures of capacitance
code.
The fourth digit is number of zeros
following
Example: 0334=330nF.
Note: C1 = 2C2
M = ±20%
C = C0G/
NP0
X = X7R
T=178mm (7”) reel
R=330mm (13”)
reel
B = Bulk
Syfer X2Y
Integrated
Passive
Component
178mm
(7”) reel
0603
0805
1206
1410
1812
2220
4000
3000
2500
2000
1000
330mm
(13”) reel
0603
0805
1206
1410
1812
2220
16000
12000
10000
8000
4000
Reeled
quantities
The internal structure furnishes a reduced inductance when
compared to that of a conventional capacitor. This is a result
of the novel internal electrode structure which inherently
reduces the inductance by the cancellation effect of opposing
currents in close proximity. The capacitance line to ground
(common mode) is closely matched due to the symmetry
within the design. As the device includes line to ground
capacitance for both lines, any temperature, ageing and
voltage effects will have an equal influence on both lines
therefore maintaining balanced decoupling.
Because the part acts as a de-coupling device, the current
limitations of a standard 3 terminal chip do not apply. The
single line 3 terminal feedthrough chip carries the signal
current through the very thin feedthrough electrodes within
the device which have limited dc resistance and so can cause
excessive heating, hence the maximum permissible current
is often limited to around 300mA for a 1206 device. The
Integrated Passive Component is in by-pass across two lines
and so is unaffected by high signal currents.
The table below offers a comparison of de-coupling devices
and demonstrates how the Integrated Passive Component
extends the options for EMC circuit protection.
INPUT 1
INPUT 2
GROUND
A
B
C1
C2
SIGNAL
RETURN
C1
Component
Advantages
Disadvantages
Applications
Chip capacitor
Industry standard
Requires 1 per line
High inductance
Capacitance matching problems
By-pass
Low frequency
3 terminal
feedthrough
Feedthrough
Lower inductance
Current limited
Feedthrough
Unbalanced lines
High frequency
Syfer X2Y
Integrated Passive
Component
Very low inductance
Replaces 2 (or 3) components
Negates the effects of
temperature, voltage and ageing
Provides both common mode and
differential mode attenuation
Can be used on balanced &
unbalanced lines
Care must be taken to
optimise circuit design
By-pass
Balanced lines
High frequency
dc electric motors
Unbalanced lines
Audio amplifiers
CANBUS
-10
0
-30
-20
-70
-40
-50
-60
0.1
1
10
100
1000
5000
680nF
400nF
220nF
100nF
47nF
10nF
1nF
470pF
100pF
27pF
-10
0
-30
-20
-70
-40
-50
-60
1
10
100
1000
5000
100nF
10nF
47nF
1nF
470pF
Insertion
loss
(dB)
Insertion
loss
(dB)
Frequency (MHz)
Filtering application
Decoupling application
Surface mount EMI filters - X2Y Integrated Passive Components
filtsmx2y.ver7
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