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參數(shù)資料
| 型號(hào)： | 1640258-8 |
| 廠商： | Tyco Electronics |
| 元件分類： | 終端 |
| 英文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 中文描述： | 矩陣系列球形柵格陣列（BGA）插座 |
| 文件頁(yè)數(shù)： | 1/5頁(yè) |
| 文件大?。?/td> | 3796K |
| 代理商： | 1640258-8 |
DESCRIPTION
Tyco Electronics is pleased to announce
the Matrix Series of BGASockets utilizing
HXC 125 polymer. The sockets are fully
arrayed matrixes of contacts available on
0.80mm, 1.00mm, and 1.27mm pitch. The
solderless, compression mount HXC 125
contact system allows you to test a BGA
device without attaching it directly to the
board. The HXC 125 polymer provides
electrically transparent signal transfer.
APPLICATIONS
The HXC 125 polymer system provides
a highly conductive interconnect. This
proprietary material consists of a high
temperature polymer compound that has
been embedded with metalized
particles. The material is formed into
micro-contacts just 0.635mm in diameter
and less than 1mm high. The contacts
are held in a grid pattern by a thin
polyimide substrate. When mechanically
compressed, the contacts electrical
characteristics are optimized.
The unique design of the BGAsocket uses
an anti-overstress feature which protects
the contact and also provides a well for the
ball to rest in. This well acts as an
alignment feature which centers the BGA
ball to the HXC 125 polymer material.
Corner frames provide for gross alignment
of the package to the socket.
KEY FEATURES
Allows socketing of BGAdevices during
prototyping and development
Fully arrayed patterns available in
1.27mm, 1.00mm and 0.80mm.
Array sizes up to 40 x 40 (1.27mm), 50 x
50 (1.00mm) and 60 x 60 (0.80mm).
Unique corner frame design allows
for gross alignment of the package
to the socket
Accommodates multiple ball sizes
Developed for use in test, development
and production environments
Solderless, compression mount
HXC 125 polymer allows for easy
socket replacement
Matrix Series BGA Sockets
Featuring HXC Material System
No tooling or set up charges
Full array stops provide anti-overstress
protection and fine alignment
Compact design minimizes real
estate required
Multiple cycles
Sockets designed to accept JEDEC
standard BGA’s
Complete hardware kits available
Bolster plate provides support,
eliminating board bow
Spring plate provides even force
distribution of compression load
Single screw spring plate allows
for easy actuation
FOR MORE INFORMATION
Technical Support
Internet: http://www.tycoelectronics.com
USA: 1-800-522-6752
Canada: 1-905-470-4425
UK: 44-1908-574289
Japan: 81-44-844-8013
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1640258-9 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640261-1 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640261-2 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640261-3 | Matrix Series Ball Grid Array (BGA) Sockets |
| 1640261-4 | Matrix Series Ball Grid Array (BGA) Sockets |
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