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參數(shù)資料
| 型號： | 14OSC0501 |
| 元件分類： | XO, clock |
| 英文描述： | VCO, 14200 MHz - 15200 MHz |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 207K |
| 代理商： | 14OSC0501 |
1
3
2
4
5
6
7
Vcc1
Vtune
RF
Out
RF
Div1
RF
Div2
(Maximum
100pF)
Vcc2
Vcc3
1
3
2.000
(0.079)
0.297
(0.011)
2
0.495
(0.020)
0.000
1.631
(0.064)
4
1.229
(0.048)
5
0.732
(0.029)
1.389
(0.055)
2.000
(0.079)
6
0.991
(0.039)
7
Pre-production
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Page 3 of 5
Mechanical Drawing
Bias Arrangement
Bypass Capacitors - See App Note [2]
(Note: Engineering designator is 14OSC0501)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.480 mg.
Bond Pad #1 (RF Div2)
Bond Pad #2 (RF Div1)
Bond Pad #3 (RF Out)
Bond Pad #4 (Vcc1)
Bond Pad #5 (Vtune)
Bond Pad #6 (Vcc2)
Bond Pad #7 (Vcc3)
May 2005 - Rev 05-May-05
14.2-15.2 GHz GaAs MMIC
Voltage Controlled Oscillator
14OSC0501
14OSC0501
RF
Out
Vcc1
Vtune
Vcc2
Vcc3
RF
Div
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