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Lucent Technologies Inc.
7
Data Sheet
January 2000
1340-Type Lightwave Receiver
Pin Information
Table 1. Pin Descriptions
* Pins designated as no user connection are not connected inter-
nally within the receiver. However, to allow for future functional
upgrades, it is recommended that the user not make any connec-
tions to these pin positions.
The link-status ag is a logic output that indicates the presence or
absence of a minimum acceptable level of optical input. A logic
high on FLAG indicates the presence of a valid optical signal.
Handling Precautions
Mounting and Connections
The pigtail consists of a 39 in.
± 4 in. (1 m ± 10 cm),
62.5
m core/125 m cladding multimode ber. The
standard ber has a 0.036 in. (914
m) diameter tight-
buffered outer jacket. The minimum ber bending
radius during operation is 1.0 in. (25.4 mm).
Electrostatic Discharge
Caution: This device is susceptible to damage as
a result of electrostatic discharge (ESD).
Take proper precautions during both
handling and testing. Follow
EIA* Stan-
dard
EIA-625.
Although protection circuitry is designed into the
device, take proper precautions to avoid exposure to
ESD.
Lucent employs a human-body model (HBM) for ESD
susceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to dene the model. A standard HBM
(resistance = 1.5 k
, capacitance = 100 pF) is widely
used and, therefore, can be used for comparison pur-
poses. The HBM ESD threshold established for the
1340 receiver is
±1000 V.
Receiver Processing
The 1340-type receiver devices can withstand normal
wave-soldering processes. The complete receiver mod-
ule is not hermetically sealed; therefore, it should not
be immersed in or sprayed with any cleaning solution
or solvents. The process cap and ber pigtail jacket
deformation temperature is 85
°C. The receiver pins
can be wave-soldered at maximum temperature of
250
°C for 10 seconds.
Installation Considerations
Although the receiver features a robust design, care
should be used during handling. The optical connector
should be kept free from dust, and the process cap
should be kept in place as a dust cover when the
device is not connected to a cable. If contamination is
present on the optical connector, the use of canned air
with an extension tube should remove any debris.
Other cleaning procedures are identied in the techni-
cal note,
Cleaning Fiber-Optic Assemblies (TN95-
010LWP).
*
EIA is a registered trademark of Electronic Industries Association.
Pin Number
Description
1
Ground
2
Ground
3
Ground
4
Ground
5
No User Connection*
6
Ground
7
DATA
8
Ground
9DATA
10
NIC or Optional VPIN
11
Vcc (5 V)
12
FLAG
13
Ground
14
FLAG
15
Ground
16
Ground
17
No User Connection*
18
No User Connection*
19
No User Connection*
20
No User Connection*