參數(shù)資料
型號(hào)： 13191
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： 2.4 GHz ISM Band Low Power Transceiver
中文描述： 2.4 GHz的ISM頻帶低功率收發(fā)器
文件頁(yè)數(shù)： 1/24頁(yè)
文件大小： 252K
代理商： 13191
Freescale Semiconductor, Inc., 2004, 2005, 2006, 2007. All rights reserved.
Freescale Semiconductor
Technical Data
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
Document Number: MC13191
Rev. 1.5, 03/2007
MC13191
Package Information
Plastic Package
Case 1311-03
(QFN-32)
Scale 1:1
Ordering Information
Device
Device Marking
Package
MC13191
13191
QFN-32
1
Introduction
The MC13191 is a short range, low power, 2.4 GHz
Industrial, Scientific, and Medical (ISM) band
transceiver. The MC13191 contains a complete packet
data modem which is compliant with the IEEE
802.15.4 Standard PHY (Physical) layer. This allows the
development of proprietary point-to-point and star
networks based on the 802.15.4 packet structure and
modulation format. For full 802.15.4 Standard
compliance, the MC13192 and Freescale's 802.15.4
MAC software are required.
When combined with an appropriate microcontroller
(MCU), the MC13191 provides a cost-effective solution
for short-range data links and networks. Interface with
the MCU is accomplished using a four wire serial
peripheral interface (SPI) connection and an interrupt
request output which allows for the use of a variety of
processors. The software and processor can be scaled to
fit applications ranging from simple point-to-point to star
networks.
MC13191
2.4 GHz ISM Band Low Power
Transceiver
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 3
4 Data Transfer Mode . . . . . . . . . . . . . . . . . . . . 4
5 Electrical Characteristics . . . . . . . . . . . . . . . 6
6 Functional Description . . . . . . . . . . . . . . . . . 9
7 Pin Connections . . . . . . . . . . . . . . . . . . . . . . 12
8 Applications Information . . . . . . . . . . . . . . . 16
9 Packaging Information . . . . . . . . . . . . . . . . . 22
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