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參數(shù)資料
| 型號(hào)： | 1206CG330J9AB |
| 英文描述： | KONDENSATOR 33PF 50V 10ST |
| 中文描述： | KONDENSATOR 33PF 50V 10ST |
| 文件頁(yè)數(shù)： | 6/19頁(yè) |
| 文件大?。?/td> | 1068K |
| 代理商： | 1206CG330J9AB |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)當(dāng)前第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)
2001 Jun 13
14
BCcomponents
Product specification
Surface mount multilayer
chip capacitors
Class 1, NP0 low voltage
10, 16, 25 and 50 V
METHOD OF MOUNTING AND
DIMENSIONS OF SOLDER LANDS
For normal use the capacitors may be mounted on
printed-circuit boards or ceramic substrates by applying
wave soldering, reflow soldering (including vapour phase
soldering) or conductive adhesive in accordance with
CECC 00802 classification A. For advised soldering profiles
An improper combination of soldering, substrate and chip
size can lead to a damaging of the component. The risk
increases with the chip size and with temperature
fluctuations (
>100 °C). Therefore, it is advised to use the
smallest possible size and follow the dimensional
wave soldering. More detailed information is available
on request.
Fig.7 Reflow soldering.
Typical values (solid line).
Process limits (dotted lines).
0
50
100
150
200
250
300
250
200
150
100
50
0
10 s
260 C
130 C
( C)
t (s)
JW122
245 C
215 C
180 C
10 s
40 s
2 K/s
T
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 1206CG331J9AB | KONDENSATOR 330PF 50V 10ST |
| 1206CG470J9AB | KONDENSATOR 47PF 50V 10ST |
| 1206CG471J9AB | KONDENSATOR 470PF 50V 10ST |
| 1206YC105KA800J | KONDENSATOR 1UF 16V 10ST |
| 1206YC105K-MR | CAP. 1UF MINIREEL 500PCS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1206CG331J0BB00 | 制造商:NXP Semiconductors 功能描述: |
| 1206CG331J9AB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:KONDENSATOR 330PF 50V 10ST |
| 1206CG470J500NT | 制造商:Fenghua Advanced Technology 功能描述:Multilayer Chip Ceramic Capacitor |
| 1206CG470J9AB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:KONDENSATOR 47PF 50V 10ST |
| 1206CG470J9BB | 制造商:Yageo / Phycomp 功能描述:1206 COG ceramic cap,47pF 63V |
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