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參數(shù)資料
| 型號： | 1206CG101J9AB |
| 英文描述： | KONDENSATOR 100PF 50V 10ST |
| 中文描述： | KONDENSATOR 100pF的50V 10ST |
| 文件頁數(shù)： | 10/19頁 |
| 文件大小： | 1068K |
| 代理商： | 1206CG101J9AB |
2001 Jun 13
18
BCcomponents
Product specification
Surface mount multilayer
chip capacitors
Class 1, NP0 low voltage
10, 16, 25 and 50 V
TESTS AND REQUIREMENTS
Table 10 Test procedures and requirements
TEST
PROCEDURE
REQUIREMENTS
Visual and mechanical
no visible damage
dimensions in accordance with
specification
Capacitance
C
≤ 1000 pF, 1.0 ±0.2 Vrms; f = 1 MHz ±10%
C > 1000 pF, 1.0
±0.2 Vrms; f = 1 kHz ±10%
shall not exceed the limits given in the
detailed specification
Q value
C
≤ 1000 pF, 1.0 ±0.2 Vrms; f = 1 MHz ±10%
≥30 pF: Q ≥ 1000
<30 pF: Q
≥ 400 + 20C
C > 1000 pF, 1.0
±0.2 Vrms; f = 1 kHz ±10%
Dielectric strength
250% of rated voltage for 1 to 5 s, charge and
discharge current less than 50 mA
no visible damage or flash-over during
test
Insulation resistance
at UR (DC) for max. 60 s ±5 s
100 G
min. or 1000 F min.,
whichever is less
Temperature coefficient
with no electrical load:
55 to 125 °C at Tamb = 25 °C
30
× 106/°C
Bending test
the middle part of the substrate shall be
pressurized by means of the pressurizing rod
at a rate of about 1 mm per second until the
deflection becomes 1 mm and then the
pressure shall be maintained for 5
±1s
measurement after 24
±2 hours at room
temperature
no visible damage
C/C: ±5.0 max. or ±0.5 pF max.,
whichever is greater
this capacitance change means the
change of capacitance under specified
flexure of substrate from the capacitance
measured before the test
Solderability
230
±5 °Cfor 2 ±0.5 s; solder: SN63A
95% min. coverage of entire metallized
area
Resistance to soldering heat
260
±5 °C for 10 ±1s;
solder: SN63A;
measurement after 24
±2 hours at room
temperature
no visible damage
C/C: ±2.5% max. or ±0.25 pF max.,
whichever is greater
DF, Rins and dielectric strength to meet
initial requirements
10% max. leaching on each edge
Temperature cycle
55 to 125 °C; 5 cycles in the following
sequence:
55 °C 3/+0 for 30 ±3 minutes;
room temperature for 2 to 3 minutes;
125
°C +3/0 for 30 ±3 minutes;
room temperature for 2 to 3 minutes
measurement after 24
±2 hours at room
temperature
no visible damage
C/C: ±2.5% max. or ±0.25 pF max.,
whichever is greater
DF, Rins and dielectric strength to meet
initial requirements
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 1206CG102J9AB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:KONDENSATOR 1000PF 50V 10ST |
| 1206CG102J9B20 | 功能描述:多層陶瓷電容器MLCC - SMD/SMT Yageo 1000PF 50V 5% 1206 RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| 1206CG102K9BB2 | 制造商:PHILIPS-SEMI 功能描述: |
| 1206CG151J9BB | 制造商:Yageo / Phycomp 功能描述:1206 COG ceramic cap,150pF 50V |
| 1206CG1R0C500NT | 制造商:Fenghua Advanced Technology 功能描述:Multilayer Chip Ceramic Capacitor |
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