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參數(shù)資料
| 型號(hào)： | 120608 |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | ESD Protection Arrays, Chip Scale Package |
| 中文描述： | ESD保護(hù)陣列，芯片級(jí)封裝 |
| 文件頁(yè)數(shù)： | 1/7頁(yè) |
| 文件大小： | 239K |
| 代理商： | 120608 |
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
CM1206
ESD Protection Arrays, Chip Scale Package
Features
Functionally and pin compatible with CMD’s
PACDN2404C/08C/16C family of devices
OptiGuard
coated for improved reliability at
assembly
4, 8, or 16 transient voltage suppressors in a single
package
In-system Electrostatic Discharge (ESD) protection
to +18kV contact discharge per IEC 61000-4-2
international standard
Supports AC signal applications
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
Applications
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
Product Description
The CM1206 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD. The back-to-back Zener connections provide
ESD protection in cases where nodes with AC signals
are present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard. All I/Os are rated at +18kV
using the IEC 61000-4-2 contact discharge method.
Using the MIL-STD-883D (Method 3015) specification
for Human Body Model (HBM) ESD, all pins are pro-
tected for contact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1206 incorporates OptiGuard
coating which
results in improved reliability at assembly. The CM1206
is also available with optional lead-free finishing.
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B1
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C2
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C4
D2
D3
D4
C5
D5
C1
D1
A2
CM1206-16CS/CP
A3
A4
B2
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B1
Electrical Schematic
CM1206-04CS/CP
CM1206-08CS/CP
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