參數(shù)資料
型號: 103577-3
廠商: Tyco Electronics
元件分類: 電路板相疊連接器
英文描述: Contacts–AMPMODU Machine Applied
中文描述: 接觸體-適用AMPMODU機器
文件頁數(shù): 83/96頁
文件大?。?/td> 3917K
代理商: 103577-3
168
Catalog 1307819
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 8-08
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-8706-080-208
Receptacle Assemblies, Horizontal Mount
AMPMODU Interconnection System
Horizontal
Mount,
Receptacle
Assemblies
5
Product Facts
All receptacle assemblies
are end stackable
Contact design employs
dual cantilever beams with
built-in anti-overstress
feature
Closed entry housings help
prevent post stubbing
Wide range of sizes
available
Other versions available
upon request
Housings made of high
temperature, surface mount
compatible thermoplastic
material, 94V-O rated
Duplex gold and matte tin
plated contacts have full
nickel underplate
Housings feature PC board
standoffs
Solder tails accommodate
a PC board thickness of
.062 [1.57]
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by Canadian
Standards
Association,
File No. LR 7189
Performance
Characteristics
Mechanical Characteristics
Mating Force — 6.0 oz. [1.67N] per
contact (max.)
Unmating Force — .75 oz. [0.21N]
per contact (min.) during third mating
cycle
Durability — 200 cycles
Environmental Characteristics
Operating Temperature
-65°C to +125°C
Electrical Characteristics
Current Rating — 3.0 amperes (max.)
for single contact; 2.0 amperes (max.)
per contact when connector is fully
energized
Contact Resistance — 12 milliohms
(max.)
Insulation Resistance
5000 megohms (min.) between adjacent
contacts
Dielectric Withstanding Voltage
(at sea level) — 750 V rms
Horizontal Mount receptacle
assemblies are designed to
reliably and economically
meet the packaging and
interconnection require-
ments of today’s electronics
industry, generally for appli-
cations using the
mother/daughter board
arrangement.
This product line is offered
in both single and double
row configurations. The
.100 [2.54] centerline
assemblies are available in
a wide range of position
sizes. They have end
stacking capability which
gives the added advantage
of flexibility.
The housings are made of
high temperature, surface
mount compatible thermo-
plastic material that is 94V-0
rated. Contacts are phos-
phor bronze, fully under-
plated with nickel to help
prevent corrosion and are
available in three plating
options.
The receptacle contact is
an established proven
design with a fully enclosed,
one-piece “box” to protect
the contact area. In
addition, the receptacle
contact has dual cantilever
beams with a built-in
anti-overstress feature.
Standard solder tails
accommodate a board
thickness of .062 [1.57].
R
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